Support Us — Your donation helps us keep running

Goal: 1000 CNY，Raised: 1000 CNY

100.0%
Donate Now
Get alerts for future matching vulnerabilitiesLog in to subscribe
I. Basic Information for CVE-2019-2237
Vulnerability Information
Have questions about the vulnerability? See if Shenlong's analysis helps!
View Shenlong Deep Dive ↗

Although we use advanced large model technology, its output may still contain inaccurate or outdated information.Shenlong tries to ensure data accuracy, but please verify and judge based on the actual situation.

Vulnerability Title
N/A
Source: NVD (National Vulnerability Database)
Vulnerability Description
Failure in taking appropriate action to handle the error case If keypad gpio deactivation fails leads to silent failure scenario and subsequent logic gets executed everytime in Snapdragon Auto, Snapdragon Compute, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile in MDM9206, MDM9607, MDM9650, MDM9655, QCS605, SD 210/SD 212/SD 205, SD 410/12, SD 675, SD 712 / SD 710 / SD 670, SD 730, SD 8CX, SXR1130
Source: NVD (National Vulnerability Database)
CVSS Information
N/A
Source: NVD (National Vulnerability Database)
Vulnerability Type
N/A
Source: NVD (National Vulnerability Database)
Vulnerability Title
多款Qualcomm产品代码问题漏洞
Source: CNNVD (China National Vulnerability Database)
Vulnerability Description
Qualcomm MDM9206等都是美国高通（Qualcomm）公司的一款中央处理器（CPU）产品。 多款Qualcomm产品中存在安全漏洞。攻击者可利用该漏洞执行未授权的操作。以下产品及版本受到影响：Qualcomm MDM9206；MDM9607；MDM9650；MDM9655；QCS605；SD 210；SD 212；SD 205；SD 410/12；SD 675；SD 712；SD 710；SD 670；SD 730；SD 8CX；SXR1130。
Source: CNNVD (China National Vulnerability Database)
CVSS Information
N/A
Source: CNNVD (China National Vulnerability Database)
Vulnerability Type
N/A
Source: CNNVD (China National Vulnerability Database)
Affected Products
VendorProductAffected VersionsCPESubscribe
Qualcomm, Inc.Snapdragon Auto, Snapdragon Compute, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile MDM9206, MDM9607, MDM9650, MDM9655, QCS605, SD 210/SD 212/SD 205, SD 410/12, SD 675, SD 712 / SD 710 / SD 670, SD 730, SD 8CX, SXR1130 -
II. Public POCs for CVE-2019-2237
#POC DescriptionSource LinkShenlong Link
AI-Generated POCPremium

No public POC found.

Login to generate AI POC
III. Intelligence Information for CVE-2019-2237
Please Login to view more intelligence information
New Vulnerabilities
Product: Snapdragon Auto, Snapdragon Compute, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile
Vendor: Qualcomm, Inc.
V. Comments for CVE-2019-2237

No comments yet

Leave a comment