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I. Basic Information for CVE-2019-14085
Vulnerability Information
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Vulnerability Title
N/A
Source: NVD (National Vulnerability Database)
Vulnerability Description
Possible Integer underflow in WLAN function due to lack of check of data received from user side in Snapdragon Auto, Snapdragon Compute, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile in QCN7605, QCS605, SDA845, SDM670, SDM710, SDM845, SDM850, SM8150, SXR1130
Source: NVD (National Vulnerability Database)
CVSS Information
N/A
Source: NVD (National Vulnerability Database)
Vulnerability Type
N/A
Source: NVD (National Vulnerability Database)
Vulnerability Title
多款Qualcomm产品WLAN组件数字错误漏洞
Source: CNNVD (China National Vulnerability Database)
Vulnerability Description
Qualcomm WLAN等都是美国高通（Qualcomm）公司的产品。Qualcomm WLAN是一款使用在Qualcomm产品中的无线局域网组件。QCS605是一款中央处理器（CPU）产品。SDM670是一款中央处理器（CPU）产品。 多款Qualcomm产品中的WLAN组件存在数字错误漏洞。本地攻击者可利用该漏洞在系统上执行任意代码。以下产品及版本受到影响：Qualcomm QCN7605；QCS605；SDA845；SDM670；SDM710；SDM845；SDM850；SM8150；SXR113
Source: CNNVD (China National Vulnerability Database)
CVSS Information
N/A
Source: CNNVD (China National Vulnerability Database)
Vulnerability Type
N/A
Source: CNNVD (China National Vulnerability Database)
Affected Products
VendorProductAffected VersionsCPESubscribe
Qualcomm, Inc.Snapdragon Auto, Snapdragon Compute, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile QCN7605, QCS605, SDA845, SDM670, SDM710, SDM845, SDM850, SM8150, SXR1130 -
II. Public POCs for CVE-2019-14085
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III. Intelligence Information for CVE-2019-14085
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New Vulnerabilities
Product: Snapdragon Auto, Snapdragon Compute, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile
Vendor: Qualcomm, Inc.
V. Comments for CVE-2019-14085

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