CVE-2019-2237
Quick assessment
Affected
Qualcomm, Inc. Snapdragon Auto, Snapdragon Compute, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile
Exploitation
No confirmed in-the-wild exploitation; assess based on exposure
Recommended action
Check the vendor advisory and references for a fixed version. If immediate upgrade is impossible, restrict exposure and increase monitoring.
Qualcomm MDM9206等都是美国高通（Qualcomm）公司的一款中央处理器（CPU）产品。 多款Qualcomm产品中存在安全漏洞。攻击者可利用该漏洞执行未授权的操作。以下产品及版本受到影响：Qualcomm MDM9206；MDM9607；MDM9650；MDM9655；QCS605；SD 210；SD 212；SD 205；SD 410/12；SD 675；SD 712；SD 710；SD 670；SD 730；SD 8CX；SXR1130。
Possible ATT&CK Techniques 1 AI
T1190 · Exploit Public-Facing Application
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I. Basic Information for CVE-2019-2237
Vulnerability Information
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Vulnerability Title
N/A
Source: CVE Program / CVE List V5
Vulnerability Description
Failure in taking appropriate action to handle the error case If keypad gpio deactivation fails leads to silent failure scenario and subsequent logic gets executed everytime in Snapdragon Auto, Snapdragon Compute, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile in MDM9206, MDM9607, MDM9650, MDM9655, QCS605, SD 210/SD 212/SD 205, SD 410/12, SD 675, SD 712 / SD 710 / SD 670, SD 730, SD 8CX, SXR1130
Source: CVE Program / CVE List V5
CVSS Information
N/A
Source: CVE Program / CVE List V5
Vulnerability Type
N/A
Source: CVE Program / CVE List V5
Vulnerability Title
多款Qualcomm产品代码问题漏洞
Source: CNNVD (China National Vulnerability Database)
Vulnerability Description
Qualcomm MDM9206等都是美国高通（Qualcomm）公司的一款中央处理器（CPU）产品。 多款Qualcomm产品中存在安全漏洞。攻击者可利用该漏洞执行未授权的操作。以下产品及版本受到影响：Qualcomm MDM9206；MDM9607；MDM9650；MDM9655；QCS605；SD 210；SD 212；SD 205；SD 410/12；SD 675；SD 712；SD 710；SD 670；SD 730；SD 8CX；SXR1130。
Source: CNNVD (China National Vulnerability Database)
CVSS Information
N/A
Source: CNNVD (China National Vulnerability Database)
Vulnerability Type
N/A
Source: CNNVD (China National Vulnerability Database)
Affected Products
| Vendor | Product | Affected Versions | CPE | Subscribe |
|---|---|---|---|---|
| Qualcomm, Inc. | Snapdragon Auto, Snapdragon Compute, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile | MDM9206, MDM9607, MDM9650, MDM9655, QCS605, SD 210/SD 212/SD 205, SD 410/12, SD 675, SD 712 / SD 710 / SD 670, SD 730, SD 8CX, SXR1130 | - |
|
II. Public POCs for CVE-2019-2237
| # | POC Description | Source Link | Shenlong Link |
|---|
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Other References for CVE-2019-2237 (1)
-
https://www.qualcomm.com/company/product-security/bulletins x_refsource_CONFIRM
Same Patch Batch · Qualcomm, Inc. · 2019-07-25 · 38 CVEs total
| CVE-2019-2239 | 多款Qualcomm产品输入验证错误漏洞 | |
| CVE-2019-2326 | 多款Qualcomm产品输入验证错误漏洞 | |
| CVE-2019-2327 | 多款Qualcomm产品缓冲区错误漏洞 | |
| CVE-2019-2328 | 多款Qualcomm产品缓冲区错误漏洞 | |
| CVE-2019-2330 | 多款Qualcomm产品输入验证错误漏洞 | |
| CVE-2019-2334 | 多款Qualcomm产品代码问题漏洞 | |
| CVE-2018-13897 | 多款Qualcomm产品信息泄露漏洞 | |
| CVE-2019-2235 | 多款Qualcomm产品缓冲区错误漏洞 | |
| CVE-2019-2236 | 多款Qualcomm产品代码问题漏洞 | |
| CVE-2019-2238 | 多款Qualcomm产品缓冲区错误漏洞 | |
| CVE-2019-2322 | 多款Qualcomm产品缓冲区错误漏洞 | |
| CVE-2019-2240 | 多款Qualcomm产品代码问题漏洞 | |
| CVE-2019-2241 | 多款Qualcomm产品输入验证错误漏洞 | |
| CVE-2019-2253 | 多款Qualcomm产品缓冲区错误漏洞 | |
| CVE-2019-2254 | 多款Qualcomm产品信息泄露漏洞 | |
| CVE-2019-2263 | 多款Qualcomm产品资源管理错误漏洞 | |
| CVE-2019-2272 | 多款Qualcomm产品缓冲区错误漏洞 | |
| CVE-2019-2273 | 多款Qualcomm产品Video Driver 缓冲区错误漏洞 | |
| CVE-2019-2276 | 多款Qualcomm产品缓冲区错误漏洞 | |
| CVE-2019-2301 | 多款Qualcomm产品Kernel 缓冲区错误漏洞 |
Showing top 20 of 38 CVEs. View all on vendor page → →
IV. Related Vulnerabilities
V. Comments for CVE-2019-2237
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