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I. Basic Information for CVE-2019-2278
Vulnerability Information
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Vulnerability Title
N/A
Source: NVD (National Vulnerability Database)
Vulnerability Description
User keystore signature is ignored in boot and can lead to bypass boot image signature verification in Snapdragon Auto, Snapdragon Consumer IOT, Snapdragon Mobile in MDM9607, MDM9640, SD 425, SD 427, SD 430, SD 435, SD 450, SD 625, SD 636, SD 712 / SD 710 / SD 670, SD 845 / SD 850, SDM660
Source: NVD (National Vulnerability Database)
CVSS Information
N/A
Source: NVD (National Vulnerability Database)
Vulnerability Type
N/A
Source: NVD (National Vulnerability Database)
Vulnerability Title
多款Qualcomm产品数据伪造问题漏洞
Source: CNNVD (China National Vulnerability Database)
Vulnerability Description
Qualcomm MDM9607等都是美国高通（Qualcomm）公司的一款中央处理器（CPU）产品。 多款Qualcomm产品中的Boot存在数据伪造问题漏洞。该漏洞源于网络系统或产品未充分验证数据的来源或真实性。攻击者可利用伪造的数据进行攻击。以下产品及版本受到影响：Qualcomm MDM9607；MDM9640；SD 425；SD 427；SD 430；SD 435；SD 450；SD 625；SD 636；SD 712；SD 710；SD 670；SD 845；SD 850；SDM660。
Source: CNNVD (China National Vulnerability Database)
CVSS Information
N/A
Source: CNNVD (China National Vulnerability Database)
Vulnerability Type
N/A
Source: CNNVD (China National Vulnerability Database)
Affected Products
VendorProductAffected VersionsCPESubscribe
Qualcomm, Inc.Snapdragon Auto, Snapdragon Consumer IOT, Snapdragon Mobile MDM9607, MDM9640, SD 425, SD 427, SD 430, SD 435, SD 450, SD 625, SD 636, SD 712 / SD 710 / SD 670, SD 845 / SD 850, SDM660 -
II. Public POCs for CVE-2019-2278
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III. Intelligence Information for CVE-2019-2278
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IV. Related Vulnerabilities
Same product: Snapdragon Auto, Snapdragon Consumer IOT, Snapdragon Mobile
Same vendor: Qualcomm, Inc.
V. Comments for CVE-2019-2278

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