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I. Basic Information for CVE-2020-11143
Vulnerability Information

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Vulnerability Title
N/A
Source: NVD (National Vulnerability Database)
Vulnerability Description
Out of bound memory access during music playback with modified content due to copying data without checking destination buffer size in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables, Snapdragon Wired Infrastructure and Networking
Source: NVD (National Vulnerability Database)
CVSS Information
N/A
Source: NVD (National Vulnerability Database)
Vulnerability Type
N/A
Source: NVD (National Vulnerability Database)
Vulnerability Title
多款Qualcomm产品缓冲区错误漏洞
Source: CNNVD (China National Vulnerability Database)
Vulnerability Description
Qualcomm 芯片是美国高通(Qualcomm)公司的芯片。一种将电路(主要包括半导体设备,也包括被动组件等)小型化的方式,并时常制造在半导体晶圆表面上。 多款Qualcomm产品存在缓冲区错误漏洞,该漏洞源于复制数据而未检查目标缓冲区大小,因此在音乐播放过程中由于修改内容而超出了内存访问范围。以下产品和版本受到影响:Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdr
Source: CNNVD (China National Vulnerability Database)
CVSS Information
N/A
Source: CNNVD (China National Vulnerability Database)
Vulnerability Type
N/A
Source: CNNVD (China National Vulnerability Database)
Affected Products
VendorProductAffected VersionsCPESubscribe
Qualcomm, Inc.Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables, Snapdragon Wired Infrastructure and Networking APQ8009, APQ8017, APQ8030, APQ8037, APQ8052, APQ8053, APQ8056, APQ8060A, APQ8062, APQ8064, APQ8064AU, APQ8076, APQ8084, APQ8096AU, AQT1000, AR6003, AR8031, AR8035, AR8151, AR9374, CSRA6620, CSRA6640, MDM8215, MDM8215M, MDM8615M, MDM8635M, MDM9215, MDM9225 -
II. Public POCs for CVE-2020-11143
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III. Intelligence Information for CVE-2020-11143
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