Goal Reached Thanks to every supporter — we hit 100%!

Goal: 1000 CNY · Raised: 1359 CNY

100%
Buy Us a Coffee

CVE-2020-11165

Quick assessment

Affected
Qualcomm, Inc. Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Wired Infrastructure and Networking
Exploitation
No confirmed in-the-wild exploitation; assess based on exposure
Recommended action
Check the vendor advisory and references for a fixed version. If immediate upgrade is impossible, restrict exposure and increase monitoring.

Qualcomm 芯片是美国高通（Qualcomm）公司的芯片。一种将电路（主要包括半导体设备，也包括被动组件等）小型化的方式，并时常制造在半导体晶圆表面上。 Qualcomm 多款产品存在缓冲区错误漏洞，该漏洞源于缓冲区溢出导致内存损坏。以下产品及版本受到影响： AQT1000, AR8035, PM3003A, PM4125, PM456, PM6125, PM6150, PM6150A, PM6150L, PM6250, PM6350, PM640A, PM640L, PM640P, PM660,

AI Predicted 8.1 Difficulty: Moderate EPSS 0.16% · P5
Get alerts for future matching vulnerabilities Log in to subscribe

I. Basic Information for CVE-2020-11165

Vulnerability Information
Have questions about the vulnerability? See if Shenlong's analysis helps!
View Shenlong Deep Dive ↗

Although we use advanced large model technology, its output may still contain inaccurate or outdated information.Shenlong tries to ensure data accuracy, but please verify and judge based on the actual situation.

Vulnerability Title
N/A
Source: CVE Program / CVE List V5
Vulnerability Description
Memory corruption due to buffer overflow while copying the message provided by HLOS into buffer without validating the length of buffer in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Wired Infrastructure and Networking
Source: CVE Program / CVE List V5
CVSS Information
N/A
Source: CVE Program / CVE List V5
Vulnerability Type
N/A
Source: CVE Program / CVE List V5
Vulnerability Title
多款Qualcomm产品缓冲区错误漏洞
Source: CNNVD (China National Vulnerability Database)
Vulnerability Description
Qualcomm 芯片是美国高通（Qualcomm）公司的芯片。一种将电路（主要包括半导体设备，也包括被动组件等）小型化的方式，并时常制造在半导体晶圆表面上。 Qualcomm 多款产品存在缓冲区错误漏洞，该漏洞源于缓冲区溢出导致内存损坏。以下产品及版本受到影响： AQT1000, AR8035, PM3003A, PM4125, PM456, PM6125, PM6150, PM6150A, PM6150L, PM6250, PM6350, PM640A, PM640L, PM640P, PM660,
Source: CNNVD (China National Vulnerability Database)
CVSS Information
N/A
Source: CNNVD (China National Vulnerability Database)
Vulnerability Type
N/A
Source: CNNVD (China National Vulnerability Database)

Affected Products

Vendor Product Affected Versions CPE Subscribe
Qualcomm, Inc. Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Wired Infrastructure and Networking AQT1000, AR8035, PM3003A, PM4125, PM456, PM6125, PM6150, PM6150A, PM6150L, PM6250, PM6350, PM640A, PM640L, PM640P, PM660, PM660L, PM7150A, PM7150L, PM7250, PM7250B, PM8004, PM8005, PM8008, PM8009, PM8150A, PM8150B, PM8150C, PM8150L, PM8250, PM8350, PM8350 -

II. Public POCs for CVE-2020-11165

# POC Description Source Link Shenlong Link
AI-Generated POC Premium

No public POC found.

Login to generate AI POC

III. Intelligence Information for CVE-2020-11165

请登录查看更多情报信息。

Other References for CVE-2020-11165 (1)

Same Patch Batch · Qualcomm, Inc. · 2021-06-09 · 33 CVEs total

CVE-2020-11291 9.8 CRITICAL 多款Qualcomm产品输入验证错误漏洞
CVE-2020-11176 9.8 CRITICAL Qualcomm 组件缓冲区错误漏洞
CVE-2021-1900 8.4 HIGH Google Android资源管理错误漏洞
CVE-2020-11267 8.4 HIGH 多款Qualcomm产品缓冲区错误漏洞
CVE-2020-11306 7.8 HIGH Google Android输入验证错误漏洞
CVE-2020-11304 7.8 HIGH 多款Qualcomm产品缓冲区错误漏洞
CVE-2020-11298 7.8 HIGH Google Android安全漏洞
CVE-2020-11292 7.8 HIGH 多款Qualcomm产品安全漏洞
CVE-2021-1937 7.5 HIGH Google Android安全漏洞
CVE-2020-11258 Qualcomm WIN TZ FW 缓冲区错误漏洞
CVE-2020-11266 Qualcomm WIN TZ FW 安全漏洞
CVE-2020-11265 Qualcomm WIN TZ FW 缓冲区错误漏洞
CVE-2020-11262 高通 Qualcomm Graphics 资源管理错误漏洞
CVE-2020-11261 高通 Qualcomm Graphics 输入验证错误漏洞
CVE-2020-11260 高通 Qualcomm Core 安全漏洞
CVE-2020-11259 Qualcomm WIN TZ FW 缓冲区错误漏洞
CVE-2020-11126 Qualcomm Wlan Firmware 缓冲区错误漏洞
CVE-2020-11257 Qualcomm WIN TZ FW 缓冲区错误漏洞
CVE-2020-11256 高通 Qualcomm WIN TZ FW 缓冲区错误漏洞
CVE-2020-11250 高通 Qualcomm Dsp Service 资源管理错误漏洞

Showing top 20 of 33 CVEs. View all on vendor page → →

IV. Related Vulnerabilities

Same product: Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Wired Infrastructure and Networking
Same vendor: Qualcomm, Inc.

V. Comments for CVE-2020-11165

No comments yet

Leave a comment