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I. Basic Information for CVE-2020-11205
Vulnerability Information
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Vulnerability Title
N/A
Source: NVD (National Vulnerability Database)
Vulnerability Description
u'Possible integer overflow to heap overflow while processing command due to lack of check of packet length received' in Snapdragon Auto, Snapdragon Compute, Snapdragon Mobile in QSM8350, SA6145P, SA6150P, SA6155, SA6155P, SA8150P, SA8155P, SA8195P, SDX55M, SM8250, SM8350, SM8350P, SXR2130, SXR2130P
Source: NVD (National Vulnerability Database)
CVSS Information
N/A
Source: NVD (National Vulnerability Database)
Vulnerability Type
N/A
Source: NVD (National Vulnerability Database)
Vulnerability Title
多款Qualcomm产品输入验证错误漏洞
Source: CNNVD (China National Vulnerability Database)
Vulnerability Description
Qualcomm SA Series等都是美国高通（Qualcomm）公司的产品。Qualcomm SA Series是一种支持5G的芯片组。QualComm SDX Series是一款应用于 5G 的芯片组。QualComm SM Series是一款移动端处理器芯片。 多款Qualcomm产品存在输入验证错误漏洞，该漏洞源于缺少对收到的数据包长度的检查，在处理命令时可能出现整数溢出到堆溢出的情况。
Source: CNNVD (China National Vulnerability Database)
CVSS Information
N/A
Source: CNNVD (China National Vulnerability Database)
Vulnerability Type
N/A
Source: CNNVD (China National Vulnerability Database)
Affected Products
VendorProductAffected VersionsCPESubscribe
Qualcomm, Inc.Snapdragon Auto, Snapdragon Compute, Snapdragon Mobile QSM8350, SA6145P, SA6150P, SA6155, SA6155P, SA8150P, SA8155P, SA8195P, SDX55M, SM8250, SM8350, SM8350P, SXR2130, SXR2130P -
II. Public POCs for CVE-2020-11205
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III. Intelligence Information for CVE-2020-11205
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IV. Related Vulnerabilities
Same product: Snapdragon Auto, Snapdragon Compute, Snapdragon Mobile
Same vendor: Qualcomm, Inc.
V. Comments for CVE-2020-11205

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