Goal Reached Thanks to every supporter — we hit 100%!

Goal: 1000 CNY · Raised: 1359 CNY

100%

CVE-2020-11210

Quick assessment

Affected
Qualcomm, Inc. Snapdragon Connectivity, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Wired Infrastructure and Networking
Exploitation
No confirmed in-the-wild exploitation; assess based on exposure
Recommended action
Check the vendor advisory and references for a fixed version. If immediate upgrade is impossible, restrict exposure and increase monitoring.

Qualcomm 芯片是美国高通(Qualcomm)公司的芯片。一种将电路(主要包括半导体设备,也包括被动组件等)小型化的方式,并时常制造在半导体晶圆表面上。 Qualcomm 多款产品存在缓冲区错误漏洞,该漏洞源于XPU配置不当,可能导致RPM区域中的内存损坏。

CVSS 9.3 · Critical EPSS 0.19% · P8

Possible ATT&CK Techniques 1 AI

T1190 · Exploit Public-Facing Application
Get alerts for future matching vulnerabilities Log in to subscribe

I. Basic Information for CVE-2020-11210

Vulnerability Information

Have questions about the vulnerability? See if Shenlong's analysis helps!
View Shenlong Deep Dive ↗

Although we use advanced large model technology, its output may still contain inaccurate or outdated information.Shenlong tries to ensure data accuracy, but please verify and judge based on the actual situation.

Vulnerability Title
N/A
Source: CVE Program / CVE List V5
Vulnerability Description
Possible memory corruption in RPM region due to improper XPU configuration in Snapdragon Connectivity, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Wired Infrastructure and Networking
Source: CVE Program / CVE List V5
CVSS Information
CVSS:3.1/AV:L/AC:L/PR:N/UI:N/S:C/C:H/I:H/A:H
Source: CVE Program / CVE List V5
Vulnerability Type
N/A
Source: CVE Program / CVE List V5
Vulnerability Title
Qualcomm 缓冲区错误漏洞
Source: CNNVD (China National Vulnerability Database)
Vulnerability Description
Qualcomm 芯片是美国高通(Qualcomm)公司的芯片。一种将电路(主要包括半导体设备,也包括被动组件等)小型化的方式,并时常制造在半导体晶圆表面上。 Qualcomm 多款产品存在缓冲区错误漏洞,该漏洞源于XPU配置不当,可能导致RPM区域中的内存损坏。
Source: CNNVD (China National Vulnerability Database)
CVSS Information
N/A
Source: CNNVD (China National Vulnerability Database)
Vulnerability Type
N/A
Source: CNNVD (China National Vulnerability Database)

Affected Products

Vendor Product Affected Versions CPE Subscribe
Qualcomm, Inc. Snapdragon Connectivity, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Wired Infrastructure and Networking AR8035, PM4125, PM4250, PM6125, PM6150A, PM6150L, PM6350, PM7250B, PM8008, PMD9655, PMI632, PMK8003, QAT3519, QAT3522, QAT3555, QAT5515, QAT5516, QCA6390, QCA9984, QCM2290, QCM4290, QCS2290, QCS405, QCS4290, QDM2301, QDM2302, QET4101, QET6105, QPA4360, QP -

II. Public POCs for CVE-2020-11210

# POC Description Source Link Shenlong Link
AI-Generated POC Premium

No public POC found.

Login to generate AI POC

III. Intelligence Information for CVE-2020-11210

请登录查看更多情报信息。

Same Patch Batch · Qualcomm, Inc. · 2021-04-07 · 15 CVEs total

CVE-2021-1892 8.4 HIGH 多款Qualcomm芯片输入验证错误漏洞
CVE-2020-11246 8.4 HIGH Qualcomm 芯片 资源管理错误漏洞
CVE-2020-11245 8.4 HIGH Qualcomm 芯片 输入验证错误漏洞
CVE-2020-11242 8.4 HIGH Qualcomm 芯片 安全漏洞
CVE-2020-11236 8.4 HIGH 多款Qualcomm产品缓冲区错误漏洞
CVE-2020-11237 8.4 HIGH Qualcomm 芯片 输入验证错误漏洞
CVE-2020-11234 8.4 HIGH Qualcomm 芯片 资源管理错误漏洞
CVE-2020-11247 8.2 HIGH Qualcomm 芯片 缓冲区错误漏洞
CVE-2020-11251 8.2 HIGH Qualcomm 芯片 缓冲区错误漏洞
CVE-2020-11191 8.2 HIGH Qualcomm 芯片 缓冲区错误漏洞
CVE-2020-11255 7.5 HIGH Qualcomm 芯片 安全漏洞
CVE-2020-11243 7.5 HIGH Qualcomm 芯片 安全漏洞
CVE-2020-11252 7.2 HIGH Qualcomm 芯片 缓冲区错误漏洞
CVE-2020-11231 6.7 MEDIUM Qualcomm 芯片 资源管理错误漏洞

IV. Related Vulnerabilities

V. Comments for CVE-2020-11210

No comments yet


Leave a comment