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I. Basic Information for CVE-2020-11217
Vulnerability Information
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Vulnerability Title
N/A
Source: NVD (National Vulnerability Database)
Vulnerability Description
A possible double free or invalid memory access in audio driver while reading Speaker Protection parameters in Snapdragon Compute, Snapdragon Connectivity, Snapdragon Industrial IOT, Snapdragon Mobile
Source: NVD (National Vulnerability Database)
CVSS Information
N/A
Source: NVD (National Vulnerability Database)
Vulnerability Type
N/A
Source: NVD (National Vulnerability Database)
Vulnerability Title
多款Qualcomm产品资源管理错误漏洞
Source: CNNVD (China National Vulnerability Database)
Vulnerability Description
Qualcomm 芯片是美国高通（Qualcomm）公司的芯片。一种将电路（主要包括半导体设备，也包括被动组件等）小型化的方式，并时常制造在半导体晶圆表面上。 多款Qualcomm产品存在资源管理错误漏洞，该漏洞源于读取扬声器保护参数时，音频驱动程序中可能存在双重空闲或无效的内存访问。以下产品和版本受到影响：Snapdragon Compute, Snapdragon Connectivity, Snapdragon Industrial IOT, Snapdragon Mobile
Source: CNNVD (China National Vulnerability Database)
CVSS Information
N/A
Source: CNNVD (China National Vulnerability Database)
Vulnerability Type
N/A
Source: CNNVD (China National Vulnerability Database)
Affected Products
VendorProductAffected VersionsCPESubscribe
Qualcomm, Inc.Snapdragon Compute, Snapdragon Connectivity, Snapdragon Industrial IOT, Snapdragon Mobile PM3003A, PM4125, PM6125, PM6150A, PM6150L, PM6350, PM660, PM660A, PM660L, PM7150A, PM7150L, PM7250, PM7250B, PM7350C, PM8008, PM8009, PM8150A, PM8150B, PM8150C, PM8150L, PM8250, PM8350, PM8350B, PM8350BH, PM8350BHS, PM8350C, PMI632, PMK7350, PMK8002, PMK8 -
II. Public POCs for CVE-2020-11217
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III. Intelligence Information for CVE-2020-11217
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IV. Related Vulnerabilities
Same product: Snapdragon Compute, Snapdragon Connectivity, Snapdragon Industrial IOT, Snapdragon Mobile
Same vendor: Qualcomm, Inc.
V. Comments for CVE-2020-11217

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