Qualcomm 芯片是美国高通(Qualcomm)公司的芯片。一种将电路(主要包括半导体设备,也包括被动组件等)小型化的方式,并时常制造在半导体晶圆表面上。 Qualcomm 多款产品存在信息泄露漏洞,该漏洞源于父进程在比较数字 pid 并且这些 pid 可以重用,导致子进程可能会从父进程泄漏信息。
Although we use advanced large model technology, its output may still contain inaccurate or outdated information.Shenlong tries to ensure data accuracy, but please verify and judge based on the actual situation.
| Vendor | Product | Affected Versions | CPE | Subscribe |
|---|---|---|---|---|
| Qualcomm, Inc. | Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables | APQ8009, APQ8009W, APQ8017, APQ8053, APQ8064AU, APQ8076, APQ8096AU, AQT1000, AR8031, AR8035, CSR6030, CSRA6620, CSRA6640, CSRB31024, FSM10055, FSM10056, MDM9150, MDM9206, MDM9250, MDM9607, MDM9626, MDM9628, MDM9640, MDM9650, MSM8909W, MSM8917, MSM8953, MS | - |
|
| # | POC Description | Source Link | Shenlong Link |
|---|
No public POC found.
Login to generate AI POC| CVE-2021-1916 | 9.8 CRITICAL | 多款Qualcomm产品缓冲区错误漏洞 |
| CVE-2021-1919 | 9.8 CRITICAL | Qualcomm 芯片数字错误漏洞 |
| CVE-2021-1920 | 9.8 CRITICAL | Qualcomm 芯片数字错误漏洞 |
| CVE-2021-1972 | 9.8 CRITICAL | 多款Qualcomm产品安全漏洞 |
| CVE-2020-11264 | 9.1 CRITICAL | 多款Qualcomm产品授权问题漏洞 |
| CVE-2020-11301 | 9.1 CRITICAL | Qualcomm 芯片授权问题漏洞 |
| CVE-2021-1923 | 7.8 HIGH | 多款Qualcomm产品代码问题漏洞 |
| CVE-2021-1914 | 7.5 HIGH | 多款Qualcomm产品安全漏洞 |
| CVE-2021-1929 | 6.2 MEDIUM | Qualcomm 芯片安全漏洞 |
| CVE-2021-1930 | 5.5 MEDIUM | Qualcomm多款产品 缓冲区错误漏洞 |
| CVE-2021-1928 | 4.6 MEDIUM | 多款Qualcomm产品缓冲区错误漏洞 |
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