CVE-2021-1919
Quick assessment
Affected
Qualcomm, Inc. Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Voice & Music, Snapdragon Wearables
Exploitation
No confirmed in-the-wild exploitation; assess based on exposure
Recommended action
Check the vendor advisory and references for a fixed version. If immediate upgrade is impossible, restrict exposure and increase monitoring.
Qualcomm 芯片是美国高通（Qualcomm）公司的芯片。一种将电路（主要包括半导体设备，也包括被动组件等）小型化的方式，并时常制造在半导体晶圆表面上。 Qualcomm芯片存在数字错误漏洞，该漏洞详情请关注厂商主页。受影响的产品和版本如下:APQ8009、APQ8009W、APQ8017、APQ8037、APQ8053、APQ8084、APQ8096AU、AQT1000、CSR6030、CSRB31024、MDM8207、MDM9150、MDM9206、MDM9207、MDM9250、MDM960
Possible ATT&CK Techniques 1 AI
T1190 · Exploit Public-Facing Application
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I. Basic Information for CVE-2021-1919
Vulnerability Information
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Vulnerability Title
N/A
Source: CVE Program / CVE List V5
Vulnerability Description
Integer underflow can occur when the RTCP length is lesser than than the actual blocks present in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Voice & Music, Snapdragon Wearables
Source: CVE Program / CVE List V5
CVSS Information
CVSS:3.1/AV:N/AC:L/PR:N/UI:N/S:U/C:H/I:H/A:H
Source: CVE Program / CVE List V5
Vulnerability Type
N/A
Source: CVE Program / CVE List V5
Vulnerability Title
Qualcomm 芯片数字错误漏洞
Source: CNNVD (China National Vulnerability Database)
Vulnerability Description
Qualcomm 芯片是美国高通（Qualcomm）公司的芯片。一种将电路（主要包括半导体设备，也包括被动组件等）小型化的方式，并时常制造在半导体晶圆表面上。 Qualcomm芯片存在数字错误漏洞，该漏洞详情请关注厂商主页。受影响的产品和版本如下:APQ8009、APQ8009W、APQ8017、APQ8037、APQ8053、APQ8084、APQ8096AU、AQT1000、CSR6030、CSRB31024、MDM8207、MDM9150、MDM9206、MDM9207、MDM9250、MDM960
Source: CNNVD (China National Vulnerability Database)
CVSS Information
N/A
Source: CNNVD (China National Vulnerability Database)
Vulnerability Type
N/A
Source: CNNVD (China National Vulnerability Database)
Affected Products
| Vendor | Product | Affected Versions | CPE | Subscribe |
|---|---|---|---|---|
| Qualcomm, Inc. | Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Voice & Music, Snapdragon Wearables | APQ8009, APQ8009W, APQ8017, APQ8037, APQ8084, APQ8096AU, AQT1000, CSR6030, CSRB31024, MDM8207, MDM9150, MDM9206, MDM9207, MDM9250, MDM9607, MDM9625, MDM9628, MDM9635M, MDM9640, MDM9645, MDM9650, MDM9655, MSM8108, MSM8208, MSM8209, MSM8608, MSM8909W, MSM89 | - |
|
II. Public POCs for CVE-2021-1919
| # | POC Description | Source Link | Shenlong Link |
|---|
AI-Generated POC
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No public POC found.
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Other References for CVE-2021-1919 (1)
-
https://www.qualcomm.com/company/product-security/bulletins/august-2021-bulletin x_refsource_CONFIRM
Same Patch Batch · Qualcomm, Inc. · 2021-09-08 · 12 CVEs total
| CVE-2021-1916 | 9.8 CRITICAL | 多款Qualcomm产品缓冲区错误漏洞 |
| CVE-2021-1920 | 9.8 CRITICAL | Qualcomm 芯片数字错误漏洞 |
| CVE-2021-1972 | 9.8 CRITICAL | 多款Qualcomm产品安全漏洞 |
| CVE-2020-11264 | 9.1 CRITICAL | 多款Qualcomm产品授权问题漏洞 |
| CVE-2020-11301 | 9.1 CRITICAL | Qualcomm 芯片授权问题漏洞 |
| CVE-2021-1923 | 7.8 HIGH | 多款Qualcomm产品代码问题漏洞 |
| CVE-2021-1914 | 7.5 HIGH | 多款Qualcomm产品安全漏洞 |
| CVE-2021-1904 | 6.2 MEDIUM | Qualcomm 芯片信息泄露漏洞 |
| CVE-2021-1929 | 6.2 MEDIUM | Qualcomm 芯片安全漏洞 |
| CVE-2021-1930 | 5.5 MEDIUM | Qualcomm多款产品 缓冲区错误漏洞 |
| CVE-2021-1928 | 4.6 MEDIUM | 多款Qualcomm产品缓冲区错误漏洞 |
IV. Related Vulnerabilities
V. Comments for CVE-2021-1919
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