Goal Reached Thanks to every supporter — we hit 100%!

Goal: 1000 CNY · Raised: 1359 CNY

100%
Buy Us a Coffee

CVE-2022-33248— Integer overflow to buffer overflow in User Identity Module

Quick assessment

Affected
Qualcomm, Inc. Snapdragon
Exploitation
No confirmed in-the-wild exploitation; assess based on exposure
Recommended action
Check the vendor advisory and references for a fixed version. If immediate upgrade is impossible, restrict exposure and increase monitoring.

Qualcomm 芯片是美国高通（Qualcomm）公司的芯片。一种将电路（主要包括半导体设备，也包括被动组件等）小型化的方式，并时常制造在半导体晶圆表面上。 Qualcomm 芯片 User Identity 模块存在安全漏洞，该漏洞源于当通过 qmi http 接收分段时，由于整数溢出到缓冲区溢出，用户身份模块中的内存损坏。

CVSS 7.8 · High EPSS 0.12% · P2

Possible ATT&CK Techniques 1 AI

T1190 · Exploit Public-Facing Application
Get alerts for future matching vulnerabilities Log in to subscribe

I. Basic Information for CVE-2022-33248

Vulnerability Information
Have questions about the vulnerability? See if Shenlong's analysis helps!
View Shenlong Deep Dive ↗

Although we use advanced large model technology, its output may still contain inaccurate or outdated information.Shenlong tries to ensure data accuracy, but please verify and judge based on the actual situation.

Vulnerability Title
Integer overflow to buffer overflow in User Identity Module
Source: CVE Program / CVE List V5
Vulnerability Description
Memory corruption in User Identity Module due to integer overflow to buffer overflow when a segement is received via qmi http.
Source: CVE Program / CVE List V5
CVSS Information
CVSS:3.1/AV:L/AC:L/PR:L/UI:N/S:U/C:H/I:H/A:H
Source: CVE Program / CVE List V5
Vulnerability Type
整数溢出导致缓冲区溢出
Source: CVE Program / CVE List V5
Vulnerability Title
Qualcomm 芯片输入验证错误漏洞
Source: CNNVD (China National Vulnerability Database)
Vulnerability Description
Qualcomm 芯片是美国高通（Qualcomm）公司的芯片。一种将电路（主要包括半导体设备，也包括被动组件等）小型化的方式，并时常制造在半导体晶圆表面上。 Qualcomm 芯片 User Identity 模块存在安全漏洞，该漏洞源于当通过 qmi http 接收分段时，由于整数溢出到缓冲区溢出，用户身份模块中的内存损坏。
Source: CNNVD (China National Vulnerability Database)
CVSS Information
N/A
Source: CNNVD (China National Vulnerability Database)
Vulnerability Type
N/A
Source: CNNVD (China National Vulnerability Database)

Affected Products

Vendor Product Affected Versions CPE Subscribe
Qualcomm, Inc. Snapdragon APQ8009 -

II. Public POCs for CVE-2022-33248

# POC Description Source Link Shenlong Link
AI-Generated POC Premium

No public POC found.

Login to generate AI POC

III. Intelligence Information for CVE-2022-33248

请登录查看更多情报信息。

Other References for CVE-2022-33248 (1)

Same Patch Batch · Qualcomm, Inc. · 2023-02-09 · 27 CVEs total

CVE-2022-25729 9.8 CRITICAL Improper Input Validation in MODEM
CVE-2022-40514 9.8 CRITICAL Buffer copy without checking size of input in WLAN Firmware
CVE-2022-33279 9.8 CRITICAL Stack based buffer overflow in WLAN
CVE-2022-33232 9.3 CRITICAL Buffer copy without checking size of input in Hypervisor
CVE-2022-33277 8.4 HIGH Buffer copy without checking size of input in modem
CVE-2022-33243 8.4 HIGH Improper access control in Qualcomm IPC
CVE-2022-25728 8.2 HIGH Buffer Over-read in MODEM
CVE-2022-25732 8.2 HIGH Buffer Over-read in MODEM
CVE-2022-25738 8.2 HIGH Buffer Over-read in MODEM
CVE-2022-33229 8.2 HIGH Buffer over-read in Modem
CVE-2022-33271 8.2 HIGH Buffer over-read in WLAN
CVE-2022-33233 7.8 HIGH Configuration weakness in modem
CVE-2022-33306 7.5 HIGH Buffer over-read in WLAN
CVE-2022-34145 7.5 HIGH Buffer over-read in WLAN Host
CVE-2022-34146 7.5 HIGH Improper input validation in WLAN Host
CVE-2022-25735 7.5 HIGH Null Pointer Dereference in MODEM
CVE-2022-25734 7.5 HIGH Loop with Unreachable Exit Condition in MODEM
CVE-2022-25733 7.5 HIGH Null Pointer Dereference in MODEM
CVE-2022-40502 7.5 HIGH Improper input validation in WLAN Host
CVE-2022-40512 7.5 HIGH Buffer over-read in WLAN Firmware.

Showing top 20 of 27 CVEs. View all on vendor page → →

IV. Related Vulnerabilities

Same product: Snapdragon
Same vendor: Qualcomm, Inc.
Same weakness: CWE-680

V. Comments for CVE-2022-33248

No comments yet

Leave a comment