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CVE-2022-33257— Time-of-check time-of-use race condition in Core

Quick assessment

Affected
Qualcomm, Inc. Snapdragon
Exploitation
No confirmed in-the-wild exploitation; assess based on exposure
Recommended action
Check the vendor advisory and references for a fixed version. If immediate upgrade is impossible, restrict exposure and increase monitoring.

Qualcomm 芯片是美国高通（Qualcomm）公司的芯片。一种将电路（主要包括半导体设备，也包括被动组件等）小型化的方式，并时常制造在半导体晶圆表面上。 Qualcomm 芯片存在安全漏洞。目前尚无此漏洞的相关信息，请随时关注CNNVD或厂商公告。

CVSS 9.3 · Critical EPSS 0.09% · P0

Possible ATT&CK Techniques 1 AI

T1207 · Rogue Domain Controller
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I. Basic Information for CVE-2022-33257

Vulnerability Information
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Vulnerability Title
Time-of-check time-of-use race condition in Core
Source: CVE Program / CVE List V5
Vulnerability Description
Memory corruption in Core due to time-of-check time-of-use race condition during dump collection in trust zone.
Source: CVE Program / CVE List V5
CVSS Information
CVSS:3.1/AV:L/AC:L/PR:N/UI:N/S:C/C:H/I:H/A:H
Source: CVE Program / CVE List V5
Vulnerability Type
检查时间与使用时间(TOCTOU)的竞争条件
Source: CVE Program / CVE List V5
Vulnerability Title
Qualcomm 芯片 安全漏洞
Source: CNNVD (China National Vulnerability Database)
Vulnerability Description
Qualcomm 芯片是美国高通（Qualcomm）公司的芯片。一种将电路（主要包括半导体设备，也包括被动组件等）小型化的方式，并时常制造在半导体晶圆表面上。 Qualcomm 芯片存在安全漏洞。目前尚无此漏洞的相关信息，请随时关注CNNVD或厂商公告。
Source: CNNVD (China National Vulnerability Database)
CVSS Information
N/A
Source: CNNVD (China National Vulnerability Database)
Vulnerability Type
N/A
Source: CNNVD (China National Vulnerability Database)

Affected Products

Vendor Product Affected Versions CPE Subscribe
Qualcomm, Inc. Snapdragon AQT1000 -

II. Public POCs for CVE-2022-33257

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III. Intelligence Information for CVE-2022-33257

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Other References for CVE-2022-33257 (1)

Same Patch Batch · Qualcomm, Inc. · 2023-03-07 · 25 CVEs total

CVE-2022-33256 9.8 CRITICAL Improper validation of array index in Multi-mode call processor
CVE-2022-40539 8.4 HIGH Improper Validation of Array Index in Automotive Android OS
CVE-2022-25655 8.4 HIGH Buffer copy without checking the size of input in WLAN HAL.
CVE-2022-25694 8.4 HIGH Use of Out-of-range Pointer Offset in MODEM
CVE-2022-25709 8.4 HIGH Use of Out-of-range Pointer Offset in Data Modem
CVE-2022-40530 8.4 HIGH Integer overflow to buffer overflow in WLAN
CVE-2022-40540 8.4 HIGH Buffer copy without checking the size of input in Linux Kernel
CVE-2022-40531 8.4 HIGH Incorrect type conversion in WLAN
CVE-2022-25705 7.8 HIGH Integer Overflow to Buffer Overflow in Modem
CVE-2022-33278 7.8 HIGH Buffer copy without checking the size of input in HLOS
CVE-2022-33242 7.8 HIGH Improper authentication in Qualcomm IPC
CVE-2022-40527 7.5 HIGH Reachable Assertion in WLAN Embedded SW
CVE-2022-40535 7.5 HIGH Buffer Over-read in WLAN
CVE-2022-33213 7.5 HIGH Memory Corruption in MODEM
CVE-2022-33244 7.5 HIGH Reachable assertion in Modem
CVE-2022-33250 7.5 HIGH Reachable assertion in Modem
CVE-2022-33254 7.5 HIGH Reachable assertion in Modem
CVE-2022-33272 7.5 HIGH Reachable assertion in Modem
CVE-2022-33309 7.5 HIGH Buiffer over-read in WLAN Firmware.
CVE-2022-40537 7.3 HIGH Improper Validation of Array Index in Bluetooth HOST

Showing top 20 of 25 CVEs. View all on vendor page → →

IV. Related Vulnerabilities

Same product: Snapdragon
Same vendor: Qualcomm, Inc.
Same weakness: CWE-367

V. Comments for CVE-2022-33257

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