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CVE-2023-21624— Information Exposure in DSP Services

Quick assessment

Affected
Qualcomm, Inc. Snapdragon
Exploitation
No confirmed in-the-wild exploitation; assess based on exposure
Recommended action
Check the vendor advisory and references for a fixed version. If immediate upgrade is impossible, restrict exposure and increase monitoring.

Qualcomm Chipsets是美国高通（Qualcomm）公司的一系列芯片组。 Qualcomm Chipsets存在安全漏洞，该漏洞源于加载动态模块时DSP服务中信息泄露。以下产品和版本受到影响：FastConnect 6700, FastConnect 6800, FastConnect 6900, QAM8255P, QCA6310, QCA6320, QCA6391, QCA6426, QCA6436, QCA6574, QCA6574A, QCA6574AU, QCA6595AU, QCA

CVSS 6.2 · Medium EPSS 0.11% · P1

Possible ATT&CK Techniques 1 AI

T1530 · Data from Cloud Storage
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I. Basic Information for CVE-2023-21624

Vulnerability Information
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Vulnerability Title
Information Exposure in DSP Services
Source: CVE Program / CVE List V5
Vulnerability Description
Information disclosure in DSP Services while loading dynamic module.
Source: CVE Program / CVE List V5
CVSS Information
CVSS:3.1/AV:L/AC:L/PR:N/UI:N/S:U/C:H/I:N/A:N
Source: CVE Program / CVE List V5
Vulnerability Type
信息暴露
Source: CVE Program / CVE List V5
Vulnerability Title
Qualcomm Chipsets 安全漏洞
Source: CNNVD (China National Vulnerability Database)
Vulnerability Description
Qualcomm Chipsets是美国高通（Qualcomm）公司的一系列芯片组。 Qualcomm Chipsets存在安全漏洞，该漏洞源于加载动态模块时DSP服务中信息泄露。以下产品和版本受到影响：FastConnect 6700, FastConnect 6800, FastConnect 6900, QAM8255P, QCA6310, QCA6320, QCA6391, QCA6426, QCA6436, QCA6574, QCA6574A, QCA6574AU, QCA6595AU, QCA
Source: CNNVD (China National Vulnerability Database)
CVSS Information
N/A
Source: CNNVD (China National Vulnerability Database)
Vulnerability Type
N/A
Source: CNNVD (China National Vulnerability Database)

Affected Products

Vendor Product Affected Versions CPE Subscribe
Qualcomm, Inc. Snapdragon FastConnect 6700 -

II. Public POCs for CVE-2023-21624

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III. Intelligence Information for CVE-2023-21624

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Other References for CVE-2023-21624 (1)

Same Patch Batch · Qualcomm, Inc. · 2023-07-04 · 18 CVEs total

CVE-2023-22667 8.4 HIGH Integer Overflow or Wraparound in Audio
CVE-2023-21672 8.4 HIGH Use After Free in Audio
CVE-2023-28541 7.8 HIGH Buffer Over-read in WLAN Host
CVE-2023-24854 7.8 HIGH Stack-based Buffer Overflow in WLAN HOST
CVE-2023-24851 7.8 HIGH Buffer Copy Without Checking Size of Input in WLAN HOST
CVE-2023-22387 7.8 HIGH Use of Out-of-range Pointer Offset in Qualcomm IPC
CVE-2023-22386 7.8 HIGH Buffer Copy Without Checking Size of Input in WLAN HOST
CVE-2023-28542 7.8 HIGH Buffer Over-read in WLAN HOST
CVE-2023-21631 7.5 HIGH Improper Input Validation in Modem
CVE-2023-21629 6.8 MEDIUM Double Free in Modem
CVE-2023-21639 6.7 MEDIUM Buffer Copy Without Checking the Size of Input in Audio
CVE-2023-21638 6.7 MEDIUM Incorrect Type Conversion or Cast in Video
CVE-2023-21637 6.7 MEDIUM Improper Restrictions of Operations within the Bounds of a Memory Buffer in Linux
CVE-2023-21635 6.7 MEDIUM Buffer Copy without Checking Size of Input in Data Network Stack & Connectivity
CVE-2023-21633 6.7 MEDIUM Improper Restriction of Operations within the Bounds of a Memory Buffer in Linux
CVE-2023-21640 6.7 MEDIUM Buffer Copy Without Checking Size of Input in Linux
CVE-2023-21641 6.6 MEDIUM Permissions, Privileges, and Access Controls in Display

IV. Related Vulnerabilities

Same product: Snapdragon
Same vendor: Qualcomm, Inc.
Same weakness: CWE-200

V. Comments for CVE-2023-21624

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