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I. Basic Information for CVE-2023-22667
Vulnerability Information
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Vulnerability Title
Integer Overflow or Wraparound in Audio
Source: NVD (National Vulnerability Database)
Vulnerability Description
Memory Corruption in Audio while allocating the ion buffer during the music playback.
Source: NVD (National Vulnerability Database)
CVSS Information
CVSS:3.1/AV:L/AC:L/PR:N/UI:N/S:U/C:H/I:H/A:H
Source: NVD (National Vulnerability Database)
Vulnerability Type
整数溢出或超界折返
Source: NVD (National Vulnerability Database)
Vulnerability Title
Qualcomm Chipsets 输入验证错误漏洞
Source: CNNVD (China National Vulnerability Database)
Vulnerability Description
Qualcomm Chipsets是美国高通（Qualcomm）公司的一系列芯片组。 Qualcomm Chipsets存在安全漏洞，该漏洞源于在音乐播放期间分配缓冲区时，会出现内存损坏问题。
Source: CNNVD (China National Vulnerability Database)
CVSS Information
N/A
Source: CNNVD (China National Vulnerability Database)
Vulnerability Type
N/A
Source: CNNVD (China National Vulnerability Database)
Affected Products
VendorProductAffected VersionsCPESubscribe
Qualcomm, Inc.Snapdragon 315 5G IoT Modem -
II. Public POCs for CVE-2023-22667
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III. Intelligence Information for CVE-2023-22667
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IV. Related Vulnerabilities
Same product: Snapdragon
Same vendor: Qualcomm, Inc.
Same weakness: CWE-190
V. Comments for CVE-2023-22667

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