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CVE-2023-28555— Buffer Over-read in Audio

Quick assessment

Affected
Qualcomm, Inc. Snapdragon
Exploitation
No confirmed in-the-wild exploitation; assess based on exposure
Recommended action
Check the vendor advisory and references for a fixed version. If immediate upgrade is impossible, restrict exposure and increase monitoring.

Qualcomm Chipsets是美国高通（Qualcomm）公司的一系列芯片组。 Qualcomm 芯片存在安全漏洞，该漏洞源于在媒体编解码器解码中重新映射通道缓冲区时音频中的瞬态 DOS。

CVSS 7.5 · High EPSS 0.41% · P34

Possible ATT&CK Techniques 1 AI

T1496 · Resource Hijacking
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I. Basic Information for CVE-2023-28555

Vulnerability Information
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Vulnerability Title
Buffer Over-read in Audio
Source: CVE Program / CVE List V5
Vulnerability Description
Transient DOS in Audio while remapping channel buffer in media codec decoding.
Source: CVE Program / CVE List V5
CVSS Information
CVSS:3.1/AV:N/AC:L/PR:N/UI:N/S:U/C:N/I:N/A:H
Source: CVE Program / CVE List V5
Vulnerability Type
缓冲区上溢读取
Source: CVE Program / CVE List V5
Vulnerability Title
Qualcomm Chipsets 缓冲区错误漏洞
Source: CNNVD (China National Vulnerability Database)
Vulnerability Description
Qualcomm Chipsets是美国高通（Qualcomm）公司的一系列芯片组。 Qualcomm 芯片存在安全漏洞，该漏洞源于在媒体编解码器解码中重新映射通道缓冲区时音频中的瞬态 DOS。
Source: CNNVD (China National Vulnerability Database)
CVSS Information
N/A
Source: CNNVD (China National Vulnerability Database)
Vulnerability Type
N/A
Source: CNNVD (China National Vulnerability Database)

Affected Products

Vendor Product Affected Versions CPE Subscribe
Qualcomm, Inc. Snapdragon AR8035 -

II. Public POCs for CVE-2023-28555

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III. Intelligence Information for CVE-2023-28555

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Same Patch Batch · Qualcomm, Inc. · 2023-08-08 · 18 CVEs total

CVE-2022-40510 9.8 CRITICAL Buffer copy without checking size of input in Audio.
CVE-2023-28561 9.8 CRITICAL Buffer Copy Without Checking Size of Input in QESL
CVE-2023-21651 9.3 CRITICAL Incorrect Type Conversion or Cast in Core
CVE-2023-21643 9.1 CRITICAL Untrusted Pointer Dereference in Automotive
CVE-2023-28537 8.4 HIGH Integer Overflow or Wraparound in Audio
CVE-2023-22666 8.4 HIGH Integer Overflow or Wraparound in Audio
CVE-2023-21625 8.2 HIGH Buffer Over-read in Network Services
CVE-2023-21652 7.7 HIGH Key Management Errors in HLOS
CVE-2023-21626 7.1 HIGH Improper Authentication in HLOS.
CVE-2023-21650 6.7 MEDIUM Improper Validation of Array Index in GPS HLOS Driver
CVE-2023-21627 6.7 MEDIUM Incorrect Type Conversion or Cast in Trusted Execution Environment
CVE-2023-21648 6.7 MEDIUM Integer Overflow to Buffer Overflow in RIL
CVE-2023-21649 6.7 MEDIUM Buffer Copy Without Checking Size of Input (`Classic Buffer Overflow`) in WLAN
CVE-2023-28577 6.7 MEDIUM Multiple Dmabuf Kernel Address UAF Vulnerability
CVE-2023-28575 6.7 MEDIUM Multiple Type Confusion Vulnerability
CVE-2023-21647 6.5 MEDIUM Improper Input Validation in Bluetooth HOST
CVE-2023-28576 6.4 MEDIUM Time-of-check Time-of-use (TOCTOU) Race Condition in Camera Kernel Driver

IV. Related Vulnerabilities

Same product: Snapdragon
Same vendor: Qualcomm, Inc.
Same weakness: CWE-126

V. Comments for CVE-2023-28555

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