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CVE-2023-33037— Cryptographic Issues in Automotive

Quick assessment

Affected
Qualcomm, Inc. Snapdragon
Exploitation
No confirmed in-the-wild exploitation; assess based on exposure
Recommended action
Check the vendor advisory and references for a fixed version. If immediate upgrade is impossible, restrict exposure and increase monitoring.

Qualcomm Chipsets是美国高通（Qualcomm）公司的一系列芯片组。 Qualcomm Chipsets 存在安全漏洞，该漏洞源于解包密钥 secs2d 并使用 RPMB 数据进行验证时，汽车中存在加密问题。

CVSS 7.1 · High EPSS 0.09% · P0

Possible ATT&CK Techniques 1 AI

T1557 · Adversary-in-the-Middle
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I. Basic Information for CVE-2023-33037

Vulnerability Information
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Vulnerability Title
Cryptographic Issues in Automotive
Source: CVE Program / CVE List V5
Vulnerability Description
Cryptographic issue in Automotive while unwrapping the key secs2d and verifying with RPMB data.
Source: CVE Program / CVE List V5
CVSS Information
CVSS:3.1/AV:L/AC:L/PR:L/UI:N/S:U/C:H/I:H/A:N
Source: CVE Program / CVE List V5
Vulnerability Type
加密问题
Source: CVE Program / CVE List V5
Vulnerability Title
Qualcomm Chipsets 安全漏洞
Source: CNNVD (China National Vulnerability Database)
Vulnerability Description
Qualcomm Chipsets是美国高通（Qualcomm）公司的一系列芯片组。 Qualcomm Chipsets 存在安全漏洞，该漏洞源于解包密钥 secs2d 并使用 RPMB 数据进行验证时，汽车中存在加密问题。
Source: CNNVD (China National Vulnerability Database)
CVSS Information
N/A
Source: CNNVD (China National Vulnerability Database)
Vulnerability Type
N/A
Source: CNNVD (China National Vulnerability Database)

Affected Products

Vendor Product Affected Versions CPE Subscribe
Qualcomm, Inc. Snapdragon AR8035 -

II. Public POCs for CVE-2023-33037

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III. Intelligence Information for CVE-2023-33037

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Other References for CVE-2023-33037 (1)

Same Patch Batch · Qualcomm, Inc. · 2024-01-02 · 26 CVEs total

CVE-2023-33025 9.8 CRITICAL Buffer Copy without Checking Size of Input in Data Modem
CVE-2023-33030 9.3 CRITICAL Buffer Copy without Checking Size of Input in HLOS
CVE-2023-33032 9.3 CRITICAL Integer Overflow or Wraparound in TZ Secure OS
CVE-2023-43514 8.4 HIGH Use After Free in DSP Services
CVE-2023-33114 8.4 HIGH Use after free in Neural Processing Unit
CVE-2023-33113 8.4 HIGH Buffer Copy Without Checking Size of Input (`Classic Buffer Overflow`) in Kernel
CVE-2023-33108 8.4 HIGH Use After Free in Graphics
CVE-2023-33094 8.4 HIGH Use After Free in Linux Graphics
CVE-2023-33033 8.4 HIGH Use of Out-of-range Pointer Offset in Audio
CVE-2023-33120 7.8 HIGH Use After Free in Audio
CVE-2023-33118 7.8 HIGH Use After Free in Automotive Audio
CVE-2023-33117 7.8 HIGH Use After Free in Audio
CVE-2023-33110 7.8 HIGH Use of Out-of-range Pointer Offset in Audio
CVE-2023-33085 7.8 HIGH Buffer Copy Without Checking Size of Input (Classic Buffer Overflow) in Wearables
CVE-2023-33014 7.6 HIGH Improper Input Validation in Services
CVE-2023-43512 7.5 HIGH Buffer Over-read in Qualcomm ESL
CVE-2023-33040 7.5 HIGH Buffer Over-read in Data Modem
CVE-2023-33062 7.5 HIGH Buffer Over-read in WLAN Firmware
CVE-2023-33109 7.5 HIGH NULL Pointer Dereference in WLAN Firmware
CVE-2023-33112 7.5 HIGH Buffer Over-read in WLAN Firmware

Showing top 20 of 26 CVEs. View all on vendor page → →

IV. Related Vulnerabilities

Same product: Snapdragon
Same vendor: Qualcomm, Inc.
Same weakness: CWE-310

V. Comments for CVE-2023-33037

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