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I. Basic Information for CVE-2023-33095
Vulnerability Information
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Vulnerability Title
Reachable Assertion in Multi-Mode Call Processor
Source: NVD (National Vulnerability Database)
Vulnerability Description
Transient DOS while processing multiple payload container type with incorrect container length received in DL NAS transport OTA in NR.
Source: NVD (National Vulnerability Database)
CVSS Information
CVSS:3.1/AV:N/AC:L/PR:N/UI:N/S:U/C:N/I:N/A:H
Source: NVD (National Vulnerability Database)
Vulnerability Type
可达断言
Source: NVD (National Vulnerability Database)
Vulnerability Title
Qualcomm Chipsets 安全漏洞
Source: CNNVD (China National Vulnerability Database)
Vulnerability Description
Qualcomm Chipsets是美国高通（Qualcomm）公司的一系列芯片组。 Qualcomm Chipsets 存在安全漏洞，该漏洞源于在处理 NR 中的 DL NAS 传输 OTA 中接收到的容器长度不正确的多个有效负载容器类型时，出现拒绝服务。
Source: CNNVD (China National Vulnerability Database)
CVSS Information
N/A
Source: CNNVD (China National Vulnerability Database)
Vulnerability Type
N/A
Source: CNNVD (China National Vulnerability Database)
Affected Products
VendorProductAffected VersionsCPESubscribe
Qualcomm, Inc.Snapdragon 315 5G IoT Modem -
II. Public POCs for CVE-2023-33095
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III. Intelligence Information for CVE-2023-33095
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IV. Related Vulnerabilities
Same product: Snapdragon
Same vendor: Qualcomm, Inc.
Same weakness: CWE-617
V. Comments for CVE-2023-33095

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