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CVE-2025-47365— Integer Overflow or Wraparound in Automotive Platform

Quick assessment

Affected
Qualcomm, Inc. Snapdragon
Exploitation
No confirmed in-the-wild exploitation; assess based on exposure
Recommended action
Check the vendor advisory and references for a fixed version. If immediate upgrade is impossible, restrict exposure and increase monitoring.

Qualcomm Chipsets是美国高通（Qualcomm）公司的一系列芯片组。 Qualcomm Chipsets存在输入验证错误漏洞，该漏洞源于处理来自远程源的通信接口大型输入数据时存在内存损坏。

CVSS 7.8 · High EPSS 0.09% · P0

Possible ATT&CK Techniques 1 AI

T1190 · Exploit Public-Facing Application
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I. Basic Information for CVE-2025-47365

Vulnerability Information
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Vulnerability Title
Integer Overflow or Wraparound in Automotive Platform
Source: CVE Program / CVE List V5
Vulnerability Description
Memory corruption while processing large input data from a remote source via a communication interface.
Source: CVE Program / CVE List V5
CVSS Information
CVSS:3.1/AV:L/AC:L/PR:L/UI:N/S:U/C:H/I:H/A:H
Source: CVE Program / CVE List V5
Vulnerability Type
整数溢出或超界折返
Source: CVE Program / CVE List V5
Vulnerability Title
Qualcomm Chipsets 输入验证错误漏洞
Source: CNNVD (China National Vulnerability Database)
Vulnerability Description
Qualcomm Chipsets是美国高通（Qualcomm）公司的一系列芯片组。 Qualcomm Chipsets存在输入验证错误漏洞，该漏洞源于处理来自远程源的通信接口大型输入数据时存在内存损坏。
Source: CNNVD (China National Vulnerability Database)
CVSS Information
N/A
Source: CNNVD (China National Vulnerability Database)
Vulnerability Type
N/A
Source: CNNVD (China National Vulnerability Database)

Affected Products

Vendor Product Affected Versions CPE Subscribe
Qualcomm, Inc. Snapdragon QAM8255P -

II. Public POCs for CVE-2025-47365

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III. Intelligence Information for CVE-2025-47365

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Vendor Advisories for CVE-2025-47365 (1)

Same Patch Batch · Qualcomm, Inc. · 2025-11-04 · 13 CVEs total

CVE-2025-27074 8.8 HIGH Incorrect Calculation of Buffer Size in SCE-Mink
CVE-2025-47357 8.0 HIGH Missing Authentication for Critical Function in SMSS
CVE-2025-47368 7.8 HIGH Buffer Over-read in DSP Service
CVE-2025-47367 7.8 HIGH Out-of-bounds Write in WinBlast Driver
CVE-2025-47361 7.8 HIGH Improper Validation of Array Index in Automotive Software platform based on QNX
CVE-2025-47360 7.8 HIGH Stack-based Buffer Overflow in Automotive Software platform based on QNX
CVE-2025-47353 7.8 HIGH Exposed Dangerous Method or Function in Automotive Software platform based on QNX
CVE-2025-47352 7.8 HIGH Improper Validation of Array Index in Audio
CVE-2025-27070 7.8 HIGH Out-of-bounds Write in Windows Compute
CVE-2025-47370 6.5 MEDIUM Reachable Assertion in BT Controller
CVE-2025-47362 6.1 MEDIUM Buffer Over-read in Automotive Software platform based on QNX
CVE-2025-27064 6.1 MEDIUM Buffer Over-read in Core Services

IV. Related Vulnerabilities

Same product: Snapdragon
Same vendor: Qualcomm, Inc.
Same weakness: CWE-190

V. Comments for CVE-2025-47365

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