CVE-2025-59606— NULL Pointer Dereference in HLOS
Quick assessment
Affected
Qualcomm, Inc. Snapdragon
Exploitation
No confirmed in-the-wild exploitation; assess based on exposure
Recommended action
Check the vendor advisory and references for a fixed version. If immediate upgrade is impossible, restrict exposure and increase monitoring.
Qualcomm Chipsets是美国高通（Qualcomm）公司的一系列芯片组。 Qualcomm Chipsets存在代码问题漏洞，该漏洞源于安全数据初始化期间堆内存耗尽导致写入无效内存位置时内存损坏。
Possible ATT&CK Techniques 1 AI
T1190 · Exploit Public-Facing ApplicationAffected Version Matrix 102
| Vendor | Product | Version Range | Status |
|---|---|---|---|
| Qualcomm, Inc. | Snapdragon | Cologne |
affected |
FastConnect 6200 |
affected | ||
FastConnect 6700 |
affected | ||
FastConnect 6900 |
affected | ||
FastConnect 7800 |
affected | ||
G2 Gen 1 |
affected | ||
IQ6 Series Platform |
affected | ||
IQ8 Series Platform |
affected | ||
| … +94 more rows | |||
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I. Basic Information for CVE-2025-59606
Vulnerability Information
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Vulnerability Title
NULL Pointer Dereference in HLOS
Source: CVE Program / CVE List V5
Vulnerability Description
Memory Corruption when writing to invalid memory locations occurs due to heap memory exhaustion during secure data initialization.
Source: CVE Program / CVE List V5
CVSS Information
CVSS:3.1/AV:L/AC:L/PR:L/UI:N/S:U/C:H/I:H/A:H
Source: CVE Program / CVE List V5
Vulnerability Type
空指针解引用
Source: CVE Program / CVE List V5
Vulnerability Title
Qualcomm Chipsets 代码问题漏洞
Source: CNNVD (China National Vulnerability Database)
Vulnerability Description
Qualcomm Chipsets是美国高通（Qualcomm）公司的一系列芯片组。 Qualcomm Chipsets存在代码问题漏洞，该漏洞源于安全数据初始化期间堆内存耗尽导致写入无效内存位置时内存损坏。
Source: CNNVD (China National Vulnerability Database)
CVSS Information
N/A
Source: CNNVD (China National Vulnerability Database)
Vulnerability Type
N/A
Source: CNNVD (China National Vulnerability Database)
Affected Products
| Vendor | Product | Affected Versions | CPE | Subscribe |
|---|---|---|---|---|
| Qualcomm, Inc. | Snapdragon | Cologne | - |
|
II. Public POCs for CVE-2025-59606
| # | POC Description | Source Link | Shenlong Link |
|---|
AI-Generated POC
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Same Patch Batch · Qualcomm, Inc. · 2026-06-01 · 22 CVEs total
| CVE-2026-25277 | 8.8 HIGH | Buffer Copy Without Checking Size of Input in Secure Processor |
| CVE-2026-25276 | 8.8 HIGH | Improper Validation of Array Index in Secure Processor |
| CVE-2026-24088 | 8.2 HIGH | Missing Authentication for Critical Function in Boot |
| CVE-2025-59604 | 7.8 HIGH | NULL Pointer Dereference in SPS Applications |
| CVE-2026-25260 | 7.8 HIGH | Time-of-check Time-of-use (TOCTOU) Race Condition in DSP Service |
| CVE-2026-25259 | 7.8 HIGH | Out-of-bounds Write in DSP Service |
| CVE-2026-25258 | 7.8 HIGH | Out-of-bounds Read in DSP Service |
| CVE-2025-59605 | 7.8 HIGH | Out-of-bounds Write in HLOS |
| CVE-2026-24085 | 7.2 HIGH | Stack-based Buffer Overflow in Display |
| CVE-2026-24087 | 7.2 HIGH | Improper Validation of Syntactic Correctness of Input in Kernel |
| CVE-2026-24089 | 7.2 HIGH | Improper Validation of Syntactic Correctness of Input in Kernel |
| CVE-2026-24091 | 7.2 HIGH | Improper Validation of Syntactic Correctness of Input in Display |
| CVE-2026-24092 | 7.2 HIGH | Improper Validation of Syntactic Correctness of Input in Display |
| CVE-2026-24090 | 7.1 HIGH | Missing Authentication for Critical Function in HLOS |
| CVE-2025-59613 | 6.7 MEDIUM | Stack-based Buffer Overflow in Windows Compute |
| CVE-2025-59614 | 6.7 MEDIUM | Out-of-bounds Write in Windows Compute |
| CVE-2025-59612 | 6.7 MEDIUM | Stack-based Buffer Overflow in Windows Compute |
| CVE-2025-59611 | 6.7 MEDIUM | Out-of-bounds Write in Core Services |
| CVE-2025-59601 | 6.5 MEDIUM | Exposure of Sensitive Information Through Metadata in Powerline Communication Firmware |
| CVE-2025-59610 | 6.4 MEDIUM | Time-of-check Time-of-use (TOCTOU) Race Condition in Camera Driver |
Showing top 20 of 22 CVEs. View all on vendor page → →
IV. Related Vulnerabilities
Same product: Snapdragon
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CVE-2026-25255
Exposed function in Qualcomm Package Manager and Qualcomm So -
CVE-2026-25254
Improper authorization in Qualcomm Software Center
Same vendor: Qualcomm, Inc.
-
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CVE-2026-25255
Exposed function in Qualcomm Package Manager and Qualcomm So -
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Same weakness: CWE-476
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V. Comments for CVE-2025-59606
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