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CVE-2025-59610— Time-of-check Time-of-use (TOCTOU) Race Condition in Camera Driver

Quick assessment

Affected
Qualcomm, Inc. Snapdragon
Exploitation
No confirmed in-the-wild exploitation; assess based on exposure
Recommended action
Check the vendor advisory and references for a fixed version. If immediate upgrade is impossible, restrict exposure and increase monitoring.

Qualcomm Chipsets是美国高通（Qualcomm）公司的一系列芯片组。 Qualcomm Chipsets存在安全漏洞，该漏洞源于用户空间缓冲区并发修改导致处理API版本不匹配的IOCTL请求时内存损坏。

CVSS 6.4 · Medium EPSS 0.06% · P0

Affected Version Matrix 205

VendorProduct Version RangeStatus
Qualcomm, Inc. Snapdragon 5G Fixed Wireless Access Platform affected
C-V2X 9150 affected
CSRA6620 affected
CSRA6640 affected
CSRB31024 affected
FastConnect 6200 affected
FastConnect 6700 affected
FastConnect 6800 affected
… +197 more rows
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I. Basic Information for CVE-2025-59610

Vulnerability Information
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Vulnerability Title
Time-of-check Time-of-use (TOCTOU) Race Condition in Camera Driver
Source: CVE Program / CVE List V5
Vulnerability Description
Memory Corruption when processing IOCTL requests with mismatched API versions due to concurrent modification of user-space buffer.
Source: CVE Program / CVE List V5
CVSS Information
CVSS:3.1/AV:L/AC:H/PR:H/UI:N/S:U/C:H/I:H/A:H
Source: CVE Program / CVE List V5
Vulnerability Type
检查时间与使用时间(TOCTOU)的竞争条件
Source: CVE Program / CVE List V5
Vulnerability Title
Qualcomm Chipsets 安全漏洞
Source: CNNVD (China National Vulnerability Database)
Vulnerability Description
Qualcomm Chipsets是美国高通（Qualcomm）公司的一系列芯片组。 Qualcomm Chipsets存在安全漏洞，该漏洞源于用户空间缓冲区并发修改导致处理API版本不匹配的IOCTL请求时内存损坏。
Source: CNNVD (China National Vulnerability Database)
CVSS Information
N/A
Source: CNNVD (China National Vulnerability Database)
Vulnerability Type
N/A
Source: CNNVD (China National Vulnerability Database)

Affected Products

Vendor Product Affected Versions CPE Subscribe
Qualcomm, Inc. Snapdragon 5G Fixed Wireless Access Platform -

II. Public POCs for CVE-2025-59610

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III. Intelligence Information for CVE-2025-59610

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Same Patch Batch · Qualcomm, Inc. · 2026-06-01 · 22 CVEs total

CVE-2026-25277 8.8 HIGH Buffer Copy Without Checking Size of Input in Secure Processor
CVE-2026-25276 8.8 HIGH Improper Validation of Array Index in Secure Processor
CVE-2026-24088 8.2 HIGH Missing Authentication for Critical Function in Boot
CVE-2025-59604 7.8 HIGH NULL Pointer Dereference in SPS Applications
CVE-2026-25260 7.8 HIGH Time-of-check Time-of-use (TOCTOU) Race Condition in DSP Service
CVE-2026-25259 7.8 HIGH Out-of-bounds Write in DSP Service
CVE-2026-25258 7.8 HIGH Out-of-bounds Read in DSP Service
CVE-2025-59606 7.8 HIGH NULL Pointer Dereference in HLOS
CVE-2025-59605 7.8 HIGH Out-of-bounds Write in HLOS
CVE-2026-24085 7.2 HIGH Stack-based Buffer Overflow in Display
CVE-2026-24087 7.2 HIGH Improper Validation of Syntactic Correctness of Input in Kernel
CVE-2026-24089 7.2 HIGH Improper Validation of Syntactic Correctness of Input in Kernel
CVE-2026-24091 7.2 HIGH Improper Validation of Syntactic Correctness of Input in Display
CVE-2026-24092 7.2 HIGH Improper Validation of Syntactic Correctness of Input in Display
CVE-2026-24090 7.1 HIGH Missing Authentication for Critical Function in HLOS
CVE-2025-59613 6.7 MEDIUM Stack-based Buffer Overflow in Windows Compute
CVE-2025-59614 6.7 MEDIUM Out-of-bounds Write in Windows Compute
CVE-2025-59612 6.7 MEDIUM Stack-based Buffer Overflow in Windows Compute
CVE-2025-59611 6.7 MEDIUM Out-of-bounds Write in Core Services
CVE-2025-59601 6.5 MEDIUM Exposure of Sensitive Information Through Metadata in Powerline Communication Firmware

Showing top 20 of 22 CVEs. View all on vendor page → →

IV. Related Vulnerabilities

Same product: Snapdragon
Same vendor: Qualcomm, Inc.
Same weakness: CWE-367

V. Comments for CVE-2025-59610

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