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CVE-2026-21383— Reusing a Nonce, Key Pair in Encryption in HLOS

Quick assessment

Affected
Qualcomm, Inc. Snapdragon
Exploitation
No confirmed in-the-wild exploitation; assess based on exposure
Recommended action
Check the vendor advisory and references for a fixed version. If immediate upgrade is impossible, restrict exposure and increase monitoring.

Qualcomm Chipsets是美国Qualcomm公司的一系列芯片组。 Qualcomm Chipsets存在加密问题漏洞，该漏洞源于在对AES-GCM密钥封装使用静态初始化向量时存在加密问题，可能导致信息泄露和未授权修改。以下版本受到影响：FastConnect 6900、FastConnect 7800、LeMans_AU_LGIT、LeMansAU、Pandeiro、QAM8255P、QAM8397P、QAM8797P、QAMSRV1H、QAMSRV1M、QCA6595AU、QCA6696、Q

CVSS 7.1 · High EPSS 0.10% · P1

Possible ATT&CK Techniques 1 AI

T1557 · Adversary-in-the-Middle

Affected Version Matrix 53

VendorProduct Version RangeStatus
Qualcomm, Inc. Snapdragon FastConnect 6900 affected
FastConnect 7800 affected
LeMans_AU_LGIT affected
LeMansAU affected
Pandeiro affected
QAM8255P affected
QAM8397P affected
QAM8797P affected
… +45 more rows
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I. Basic Information for CVE-2026-21383

Vulnerability Information
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Vulnerability Title
Reusing a Nonce, Key Pair in Encryption in HLOS
Source: CVE Program / CVE List V5
Vulnerability Description
Cryptographic Issue when using a static initialization vector for AES-GCM key wrapping, which requires a unique value for each call to ensure security.
Source: CVE Program / CVE List V5
CVSS Information
CVSS:3.1/AV:L/AC:L/PR:L/UI:N/S:U/C:H/I:H/A:N
Source: CVE Program / CVE List V5
Vulnerability Type
在加密中重用Nonce与密钥对
Source: CVE Program / CVE List V5
Vulnerability Title
Qualcomm Chipsets 加密问题漏洞
Source: CNNVD (China National Vulnerability Database)
Vulnerability Description
Qualcomm Chipsets是美国Qualcomm公司的一系列芯片组。 Qualcomm Chipsets存在加密问题漏洞，该漏洞源于在对AES-GCM密钥封装使用静态初始化向量时存在加密问题，可能导致信息泄露和未授权修改。以下版本受到影响：FastConnect 6900、FastConnect 7800、LeMans_AU_LGIT、LeMansAU、Pandeiro、QAM8255P、QAM8397P、QAM8797P、QAMSRV1H、QAMSRV1M、QCA6595AU、QCA6696、Q
Source: CNNVD (China National Vulnerability Database)
CVSS Information
N/A
Source: CNNVD (China National Vulnerability Database)
Vulnerability Type
N/A
Source: CNNVD (China National Vulnerability Database)

Affected Products

Vendor Product Affected Versions CPE Subscribe
Qualcomm, Inc. Snapdragon FastConnect 6900 -

II. Public POCs for CVE-2026-21383

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III. Intelligence Information for CVE-2026-21383

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Vendor Advisories for CVE-2026-21383 (1)

Same Patch Batch · Qualcomm, Inc. · 2026-07-06 · 11 CVEs total

CVE-2026-25268 8.8 HIGH Stack-based Buffer Overflow in WLAN Host
CVE-2026-25271 7.8 HIGH Time-of-check Time-of-use (TOCTOU) Race Condition in DSP Service
CVE-2026-21379 7.8 HIGH Buffer Over-read in Windows Compute
CVE-2025-59617 6.6 MEDIUM Use After Free in Computer Vision
CVE-2025-59616 6.6 MEDIUM Use After Free in Computer Vision
CVE-2025-59615 6.6 MEDIUM Use After Free in Computer Vision
CVE-2026-21384 5.3 MEDIUM Out-of-bounds Write in Camera Driver
CVE-2026-21370 5.3 MEDIUM Out-of-bounds Write in Camera Driver
CVE-2026-21369 5.3 MEDIUM Out-of-bounds Write in Camera Driver
CVE-2026-21368 5.3 MEDIUM Out-of-bounds Write in Camera Driver

IV. Related Vulnerabilities

Same product: Snapdragon
Same vendor: Qualcomm, Inc.
Same weakness: CWE-323