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I. Basic Information for CVE-2017-18313
Vulnerability Information

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Vulnerability Title
N/A
Source: NVD (National Vulnerability Database)
Vulnerability Description
Under certain mode of operations, HLOS may be able get direct or indirect access through DXE channels to tamper with the authenticated WCNSS firmware stored in DDR because DXE-accessible memory is located within the authenticated image in Snapdragon Mobile and Snapdragon Wear in version MSM8909W, SD 210/SD 212/SD 205, SD 410/12, SD 615/16/SD 415, SD 617.
Source: NVD (National Vulnerability Database)
CVSS Information
N/A
Source: NVD (National Vulnerability Database)
Vulnerability Type
N/A
Source: NVD (National Vulnerability Database)
Vulnerability Title
多款Qualcomm Snapdragon产品访问控制错误漏洞
Source: CNNVD (China National Vulnerability Database)
Vulnerability Description
Qualcomm MSM8909W等都是美国高通(Qualcomm)公司的用于不同平台的中央处理器(CPU)产品。 多款Qualcomm Snapdragon产品中存在访问控制错误漏洞。攻击者可利用该漏洞篡改储存在DDR中已认证的WCNSS固件。以下产品(移动设备和手表)受到影响:Qualcomm MSM8909W;SD 210;SD 212;SD 205;SD 410/12;SD 615/16;SD 415;SD 617。
Source: CNNVD (China National Vulnerability Database)
CVSS Information
N/A
Source: CNNVD (China National Vulnerability Database)
Vulnerability Type
N/A
Source: CNNVD (China National Vulnerability Database)
Affected Products
VendorProductAffected VersionsCPESubscribe
Qualcomm, Inc.Snapdragon Mobile, Snapdragon Wear MSM8909W, SD 210/SD 212/SD 205, SD 410/12, SD 615/16/SD 415, SD 617 -
II. Public POCs for CVE-2017-18313
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III. Intelligence Information for CVE-2017-18313
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IV. Related Vulnerabilities
V. Comments for CVE-2017-18313

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