CVE-2018-11277
Quick assessment
Affected
Qualcomm, Inc. Snapdragon Automobile, Snapdragon Mobile, Snapdragon Wear
Exploitation
No confirmed in-the-wild exploitation; assess based on exposure
Recommended action
Check the vendor advisory and references for a fixed version. If immediate upgrade is impossible, restrict exposure and increase monitoring.
Qualcomm MSM8909W等都是美国高通（Qualcomm）公司的用于不同平台的中央处理器（CPU）产品。 多款Qualcomm Snapdragon产品中的Telephony存在权限许可和访问控制漏洞，该漏洞源于com.qualcomm.embms部署在拥有不当权限的系统镜像中，并且允许来自Play Store的任意已安装应用程序请求权限。目前尚无此漏洞的相关信息，请随时关注CNNVD或厂商公告。以下产品（用于汽车、移动设备和手表）受到影响：Qualcomm MSM8909W；MSM8996AU
Possible ATT&CK Techniques 1 AI
T1059.004 · Unix Shell
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I. Basic Information for CVE-2018-11277
Vulnerability Information
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Vulnerability Title
N/A
Source: CVE Program / CVE List V5
Vulnerability Description
In Snapdragon (Automobile, Mobile, Wear) in version MSM8909W, MSM8996AU, SD 210/SD 212/SD 205, SD 430, SD 450, SD 615/16/SD 415, SD 617, SD 625, SD 650/52, SD 810, SD 820, SD 820A, SD 835, SD 845, SDA660, the com.qualcomm.embms is a vendor package deployed in the system image which has an inadequate permission level and allows any application installed from Play Store to request this permission at install-time. The system application interfaces with the Radio Interface Layer leading to potential access control issue.
Source: CVE Program / CVE List V5
CVSS Information
N/A
Source: CVE Program / CVE List V5
Vulnerability Type
N/A
Source: CVE Program / CVE List V5
Vulnerability Title
多款Qualcomm Snapdragon产品权限许可和访问控制问题漏洞
Source: CNNVD (China National Vulnerability Database)
Vulnerability Description
Qualcomm MSM8909W等都是美国高通（Qualcomm）公司的用于不同平台的中央处理器（CPU）产品。 多款Qualcomm Snapdragon产品中的Telephony存在权限许可和访问控制漏洞，该漏洞源于com.qualcomm.embms部署在拥有不当权限的系统镜像中，并且允许来自Play Store的任意已安装应用程序请求权限。目前尚无此漏洞的相关信息，请随时关注CNNVD或厂商公告。以下产品（用于汽车、移动设备和手表）受到影响：Qualcomm MSM8909W；MSM8996AU
Source: CNNVD (China National Vulnerability Database)
CVSS Information
N/A
Source: CNNVD (China National Vulnerability Database)
Vulnerability Type
N/A
Source: CNNVD (China National Vulnerability Database)
Affected Products
| Vendor | Product | Affected Versions | CPE | Subscribe |
|---|---|---|---|---|
| Qualcomm, Inc. | Snapdragon Automobile, Snapdragon Mobile, Snapdragon Wear | MSM8909W, MSM8996AU, SD 210/SD 212/SD 205, SD 430, SD 450, SD 615/16/SD 415, SD 617, SD 625, SD 650/52, SD 810, SD 820, SD 820A, SD 835, SD 845, SDA660 | - |
|
II. Public POCs for CVE-2018-11277
| # | POC Description | Source Link | Shenlong Link |
|---|
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Other References for CVE-2018-11277 (1)
-
https://www.qualcomm.com/company/product-security/bulletins x_refsource_CONFIRM
Same Patch Batch · Qualcomm, Inc. · 2018-09-20 · 15 CVEs total
| CVE-2017-18280 | 多款Qualcomm Snapdragon产品访问控制错误漏洞 | |
| CVE-2017-18302 | 多款Qualcomm Snapdragon产品安全漏洞 | |
| CVE-2017-18314 | 多款Qualcomm Snapdragon产品访问控制错误漏洞 | |
| CVE-2018-11267 | 多款Qualcomm Snapdragon产品安全漏洞 | |
| CVE-2018-11268 | 多款Qualcomm Snapdragon产品安全漏洞 | |
| CVE-2018-11269 | 多款Qualcomm Snapdragon产品安全漏洞 | |
| CVE-2018-11285 | 多款Qualcomm Snapdragon产品缓冲区错误漏洞 | |
| CVE-2018-11287 | 多款Qualcomm Snapdragon产品安全漏洞 | |
| CVE-2018-11290 | 多款Qualcomm Snapdragon产品加密问题漏洞 | |
| CVE-2018-11291 | 多款Qualcomm Snapdragon产品加密问题漏洞 | |
| CVE-2018-11292 | 多款Qualcomm Snapdragon产品缓冲区错误漏洞 | |
| CVE-2018-11982 | 多款Qualcomm Snapdragon产品安全漏洞 | |
| CVE-2018-5837 | 多款Qualcomm Snapdragon产品加密问题漏洞 | |
| CVE-2018-5871 | 多款Qualcomm Snapdragon产品加密问题漏洞 |
IV. Related Vulnerabilities
V. Comments for CVE-2018-11277
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