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I. Basic Information for CVE-2018-11277
Vulnerability Information

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Vulnerability Title
N/A
Source: NVD (National Vulnerability Database)
Vulnerability Description
In Snapdragon (Automobile, Mobile, Wear) in version MSM8909W, MSM8996AU, SD 210/SD 212/SD 205, SD 430, SD 450, SD 615/16/SD 415, SD 617, SD 625, SD 650/52, SD 810, SD 820, SD 820A, SD 835, SD 845, SDA660, the com.qualcomm.embms is a vendor package deployed in the system image which has an inadequate permission level and allows any application installed from Play Store to request this permission at install-time. The system application interfaces with the Radio Interface Layer leading to potential access control issue.
Source: NVD (National Vulnerability Database)
CVSS Information
N/A
Source: NVD (National Vulnerability Database)
Vulnerability Type
N/A
Source: NVD (National Vulnerability Database)
Vulnerability Title
多款Qualcomm Snapdragon产品权限许可和访问控制问题漏洞
Source: CNNVD (China National Vulnerability Database)
Vulnerability Description
Qualcomm MSM8909W等都是美国高通(Qualcomm)公司的用于不同平台的中央处理器(CPU)产品。 多款Qualcomm Snapdragon产品中的Telephony存在权限许可和访问控制漏洞,该漏洞源于com.qualcomm.embms部署在拥有不当权限的系统镜像中,并且允许来自Play Store的任意已安装应用程序请求权限。目前尚无此漏洞的相关信息,请随时关注CNNVD或厂商公告。以下产品(用于汽车、移动设备和手表)受到影响:Qualcomm MSM8909W;MSM8996AU
Source: CNNVD (China National Vulnerability Database)
CVSS Information
N/A
Source: CNNVD (China National Vulnerability Database)
Vulnerability Type
N/A
Source: CNNVD (China National Vulnerability Database)
Affected Products
VendorProductAffected VersionsCPESubscribe
Qualcomm, Inc.Snapdragon Automobile, Snapdragon Mobile, Snapdragon Wear MSM8909W, MSM8996AU, SD 210/SD 212/SD 205, SD 430, SD 450, SD 615/16/SD 415, SD 617, SD 625, SD 650/52, SD 810, SD 820, SD 820A, SD 835, SD 845, SDA660 -
II. Public POCs for CVE-2018-11277
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III. Intelligence Information for CVE-2018-11277
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IV. Related Vulnerabilities
V. Comments for CVE-2018-11277

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