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I. Basic Information for CVE-2018-11865
Vulnerability Information
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Vulnerability Title
N/A
Source: NVD (National Vulnerability Database)
Vulnerability Description
Integer overflow may happen when calculating an internal structure size due to lack of validation of the input length in Snapdragon Mobile, Snapdragon Wear in version MDM9206, MDM9607, MDM9650, SD 210/SD 212/SD 205, SD 425, SD 427, SD 430, SD 435, SD 450, SD 625, SD 835, SD 845, SD 850, SDA660, SDM429, SDM439, SDM630, SDM632, SDM636, SDM660, SDM710, Snapdragon_High_Med_2016.
Source: NVD (National Vulnerability Database)
CVSS Information
N/A
Source: NVD (National Vulnerability Database)
Vulnerability Type
N/A
Source: NVD (National Vulnerability Database)
Vulnerability Title
多款Qualcomm Snapdragon产品WLAN 数字错误漏洞
Source: CNNVD (China National Vulnerability Database)
Vulnerability Description
Qualcomm MDM9206等都是美国高通（Qualcomm）公司应用于不同平台的中央处理器（CPU）产品。WLAN是其中的一个无线局域网组件。 多款Qualcomm Snapdragon产品中的WLAN存在整数溢出漏洞，该漏洞源于程序没有验证输入的长度。目前尚无此漏洞的相关信息，请随时关注CNNVD或厂商公告。以下产品（用于移动和可穿戴设备）受到影响：Qualcomm MDM9206；MDM9607；MDM9650；SD 210；SD 212；SD 205；SD 425；SD 427；SD 430；
Source: CNNVD (China National Vulnerability Database)
CVSS Information
N/A
Source: CNNVD (China National Vulnerability Database)
Vulnerability Type
N/A
Source: CNNVD (China National Vulnerability Database)
Affected Products
VendorProductAffected VersionsCPESubscribe
Qualcomm, Inc.Snapdragon Mobile, Snapdragon Wear MDM9206, MDM9607, MDM9650, SD 210/SD 212/SD 205, SD 425, SD 427, SD 430, SD 435, SD 450, SD 625, SD 835, SD 845, SD 850, SDA660, SDM429, SDM439, SDM630, SDM632, SDM636, SDM660, SDM710, Snapdragon_High_Med_2016 -
II. Public POCs for CVE-2018-11865
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III. Intelligence Information for CVE-2018-11865
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IV. Related Vulnerabilities
Same product: Snapdragon Mobile, Snapdragon Wear
Same vendor: Qualcomm, Inc.
V. Comments for CVE-2018-11865

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