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I. Basic Information for CVE-2019-10492
Vulnerability Information
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Vulnerability Title
N/A
Source: NVD (National Vulnerability Database)
Vulnerability Description
Boot image not getting verified by AVB in Snapdragon Auto, Snapdragon Mobile, Snapdragon Wearables in MDM9607, MSM8909W, Qualcomm 215, SD 210/SD 212/SD 205, SD 425, SD 427, SD 430, SD 435, SD 439 / SD 429, SD 450, SD 625, SD 632, SD 820, SD 820A, SDM439
Source: NVD (National Vulnerability Database)
CVSS Information
N/A
Source: NVD (National Vulnerability Database)
Vulnerability Type
N/A
Source: NVD (National Vulnerability Database)
Vulnerability Title
多款Qualcomm产品加密问题漏洞
Source: CNNVD (China National Vulnerability Database)
Vulnerability Description
Qualcomm MDM9607等都是美国高通（Qualcomm）公司的一款中央处理器（CPU）产品。 多款Qualcomm产品中存在加密问题漏洞。该漏洞源于网络系统或产品未正确使用相关密码算法，导致内容未正确加密、弱加密、明文存储敏感信息等。以下产品及版本受到影响：Qualcomm MDM9607；MSM8909W；Qualcomm 215；SD 210；SD 212；SD 205；SD 425；SD 427；SD 430；SD 435；SD 439；SD 429；SD 450；SD 625；SD 63
Source: CNNVD (China National Vulnerability Database)
CVSS Information
N/A
Source: CNNVD (China National Vulnerability Database)
Vulnerability Type
N/A
Source: CNNVD (China National Vulnerability Database)
Affected Products
VendorProductAffected VersionsCPESubscribe
Qualcomm, Inc.Snapdragon Auto, Snapdragon Mobile, Snapdragon Wearables MDM9607, MSM8909W, Qualcomm 215, SD 210/SD 212/SD 205, SD 425, SD 427, SD 430, SD 435, SD 439 / SD 429, SD 450, SD 625, SD 632, SD 820, SD 820A, SDM439 -
II. Public POCs for CVE-2019-10492
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III. Intelligence Information for CVE-2019-10492
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New Vulnerabilities
Product: Snapdragon Auto, Snapdragon Mobile, Snapdragon Wearables
Vendor: Qualcomm, Inc.
V. Comments for CVE-2019-10492

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