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CVE-2019-14037

Quick assessment

Affected
Qualcomm, Inc. Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables
Exploitation
No confirmed in-the-wild exploitation; assess based on exposure
Recommended action
Check the vendor advisory and references for a fixed version. If immediate upgrade is impossible, restrict exposure and increase monitoring.

Qualcomm MDM9607等都是美国高通（Qualcomm）公司的产品。MDM9607是一款中央处理器（CPU）产品。SDX24是一款调制解调器。MSM8905是一款中央处理器（CPU）产品。 多款Qualcomm产品中的Data Network Stack & Connectivity存在资源管理错误漏洞。该漏洞源于网络系统或产品对系统资源（如内存、磁盘空间、文件等）的管理不当。以下产品及版本受到影响：Qualcomm APQ8009；APQ8053；APQ8096AU；APQ8098；MDM92

AI Predicted 7.8 Difficulty: Hard EPSS 0.20% · P10

Possible ATT&CK Techniques 1 AI

T1203 · Exploitation for Client Execution
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I. Basic Information for CVE-2019-14037

Vulnerability Information
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Vulnerability Title
N/A
Source: CVE Program / CVE List V5
Vulnerability Description
Close and bind operations done on a socket can lead to a Use-After-Free condition. in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables in APQ8009, APQ8053, APQ8096AU, APQ8098, MDM9206, MDM9207C, MDM9607, MDM9640, MDM9650, MSM8905, MSM8909W, MSM8996, MSM8996AU, QCN7605, QCN7606, QCS605, SC8180X, SDA660, SDA845, SDM439, SDM630, SDM636, SDM660, SDM670, SDM710, SDM845, SDX20, SDX24, SDX55, SM8150, SXR1130
Source: CVE Program / CVE List V5
CVSS Information
N/A
Source: CVE Program / CVE List V5
Vulnerability Type
N/A
Source: CVE Program / CVE List V5
Vulnerability Title
多款Qualcomm产品资源管理错误漏洞
Source: CNNVD (China National Vulnerability Database)
Vulnerability Description
Qualcomm MDM9607等都是美国高通（Qualcomm）公司的产品。MDM9607是一款中央处理器（CPU）产品。SDX24是一款调制解调器。MSM8905是一款中央处理器（CPU）产品。 多款Qualcomm产品中的Data Network Stack & Connectivity存在资源管理错误漏洞。该漏洞源于网络系统或产品对系统资源（如内存、磁盘空间、文件等）的管理不当。以下产品及版本受到影响：Qualcomm APQ8009；APQ8053；APQ8096AU；APQ8098；MDM92
Source: CNNVD (China National Vulnerability Database)
CVSS Information
N/A
Source: CNNVD (China National Vulnerability Database)
Vulnerability Type
N/A
Source: CNNVD (China National Vulnerability Database)

Affected Products

Vendor Product Affected Versions CPE Subscribe
Qualcomm, Inc. Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables APQ8009, APQ8053, APQ8096AU, APQ8098, MDM9206, MDM9207C, MDM9607, MDM9640, MDM9650, MSM8905, MSM8909W, MSM8996, MSM8996AU, QCN7605, QCN7606, QCS605, SC8180X, SDA660, SDA845, SDM439, SDM630, SDM636, SDM660, SDM670, SDM710, SDM845, SDX20, SDX24, SDX55, SM81 -

II. Public POCs for CVE-2019-14037

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III. Intelligence Information for CVE-2019-14037

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Other References for CVE-2019-14037 (1)

Same Patch Batch · Qualcomm, Inc. · 2020-07-30 · 15 CVEs total

CVE-2020-3701 Qualcomm Saipan、SM8250和SXR2130 资源管理错误漏洞
CVE-2020-3699 多款Qualcomm产品缓冲区错误漏洞
CVE-2020-3700 多款Qualcomm产品缓冲区错误漏洞
CVE-2020-3671 多款Qualcomm产品资源管理错误漏洞
CVE-2020-3688 多款Qualcomm产品缓冲区错误漏洞
CVE-2020-3698 多款Qualcomm产品缓冲区错误漏洞
CVE-2019-14124 多款Qualcomm产品缓冲区错误漏洞
CVE-2019-14130 多款Qualcomm产品缓冲区错误漏洞
CVE-2019-14101 多款Qualcomm产品缓冲区错误漏洞
CVE-2019-14123 多款Qualcomm产品输入验证错误漏洞
CVE-2019-14099 多款Qualcomm产品安全漏洞
CVE-2019-14100 多款Qualcomm产品输入验证错误漏洞
CVE-2019-10580 多款Qualcomm产品资源管理错误漏洞
CVE-2019-14093 多款Qualcomm产品输入验证错误漏洞

IV. Related Vulnerabilities

Same product: Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables
Same vendor: Qualcomm, Inc.

V. Comments for CVE-2019-14037

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