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I. Basic Information for CVE-2020-11166
Vulnerability Information
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Vulnerability Title
N/A
Source: NVD (National Vulnerability Database)
Vulnerability Description
Potential out of bound read exception when UE receives unusually large number of padding octets in the beginning of ROHC header in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables
Source: NVD (National Vulnerability Database)
CVSS Information
N/A
Source: NVD (National Vulnerability Database)
Vulnerability Type
N/A
Source: NVD (National Vulnerability Database)
Vulnerability Title
Qualcomm 封闭源组件 安全漏洞
Source: CNNVD (China National Vulnerability Database)
Vulnerability Description
Qualcomm 组件是美国高通（Qualcomm）公司的一个组件。提供高通设备功能的内在部件。 Qualcomm封闭源组件存在安全漏洞，该漏洞源于UE在ROHC头的开始处接收到异常大量的填充字节时，可能发生的越界读异常。
Source: CNNVD (China National Vulnerability Database)
CVSS Information
N/A
Source: CNNVD (China National Vulnerability Database)
Vulnerability Type
N/A
Source: CNNVD (China National Vulnerability Database)
Affected Products
VendorProductAffected VersionsCPESubscribe
Qualcomm, Inc.Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables APQ8009, APQ8009W, APQ8017, APQ8037, APQ8053, APQ8084, APQ8096AU, AQT1000, AR6003, AR8151, CSR6030, CSRB31024, FSM10055, MDM8207, MDM8215, MDM8215M, MDM8615M, MDM9150, MDM9205, MDM9206, MDM9207, MDM9215, MDM9230, MDM9250, MDM9310, MDM9330, MDM9607, MDM961 -
II. Public POCs for CVE-2020-11166
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III. Intelligence Information for CVE-2020-11166
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IV. Related Vulnerabilities
Same product: Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables
Same vendor: Qualcomm, Inc.
V. Comments for CVE-2020-11166

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