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I. Basic Information for CVE-2020-11230
Vulnerability Information
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Vulnerability Title
N/A
Source: NVD (National Vulnerability Database)
Vulnerability Description
Potential arbitrary memory corruption when the qseecom driver updates ion physical addresses in the buffer as it exposes a physical address to user land in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Industrial IOT, Snapdragon Mobile
Source: NVD (National Vulnerability Database)
CVSS Information
N/A
Source: NVD (National Vulnerability Database)
Vulnerability Type
N/A
Source: NVD (National Vulnerability Database)
Vulnerability Title
Qualcom qseecom driver 安全漏洞
Source: CNNVD (China National Vulnerability Database)
Vulnerability Description
Qualcom qseecom driver 是美国高通（Qualcom）公司的一个内核接口。提供内核驱动连接用户态Normal world和Secure world的一个桥梁 qseecom driver 存在安全漏洞，该漏洞源于更新缓冲区中的物理地址时，潜在的任意内存损坏。
Source: CNNVD (China National Vulnerability Database)
CVSS Information
N/A
Source: CNNVD (China National Vulnerability Database)
Vulnerability Type
N/A
Source: CNNVD (China National Vulnerability Database)
Affected Products
VendorProductAffected VersionsCPESubscribe
Qualcomm, Inc.Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Industrial IOT, Snapdragon Mobile AQT1000, FSM10055, PM3003A, PM7150A, PM7150L, PM7250, PM7250B, PM7350C, PM8004, PM8008, PM8009, PM8150A, PM8150B, PM8150C, PM8150L, PM8250, PM8350, PM8350B, PM8350BH, PM8350BHS, PM8350C, PM855, PM855A, PM855B, PM855L, PM855P, PMK7350, PMK8002, PMK8350, PM -
II. Public POCs for CVE-2020-11230
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III. Intelligence Information for CVE-2020-11230
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New Vulnerabilities
Product: Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Industrial IOT, Snapdragon Mobile
Vendor: Qualcomm, Inc.
V. Comments for CVE-2020-11230

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