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I. Basic Information for CVE-2021-30347
Vulnerability Information
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Vulnerability Title
N/A
Source: NVD (National Vulnerability Database)
Vulnerability Description
Improper integrity check can lead to race condition between tasks PDCP and RRC? right after a valid RRC Command packet has been received in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Industrial IOT, Snapdragon Mobile
Source: NVD (National Vulnerability Database)
CVSS Information
CVSS:3.1/AV:N/AC:L/PR:N/UI:N/S:U/C:H/I:H/A:N
Source: NVD (National Vulnerability Database)
Vulnerability Type
N/A
Source: NVD (National Vulnerability Database)
Vulnerability Title
多款Qualcomm产品安全漏洞
Source: CNNVD (China National Vulnerability Database)
Vulnerability Description
Qualcomm 芯片是美国高通（Qualcomm）公司的芯片。一种将电路（主要包括半导体设备，也包括被动组件等）小型化的方式，并时常制造在半导体晶圆表面上。 Qualcomm 多款产品存在安全漏洞，该漏洞源于在收到有效的 RRC 命令包后，不正确的完整性检查可能导致任务 PDCP 和 RRC 之间的产生竞争条件。以下产品和版本受到影响：AR8035、QCA6390、QCA6391、QCA6426、QCA6436、QCA6574A、QCA6574AU、QCA6595AU、QCA6696、QCA8081、Q
Source: CNNVD (China National Vulnerability Database)
CVSS Information
N/A
Source: CNNVD (China National Vulnerability Database)
Vulnerability Type
N/A
Source: CNNVD (China National Vulnerability Database)
Affected Products
VendorProductAffected VersionsCPESubscribe
Qualcomm, Inc.Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Industrial IOT, Snapdragon Mobile AR8035, QCA6390, QCA6391, QCA6426, QCA6436, QCA6574A, QCA6574AU, QCA6595AU, QCA6696, QCA8081, QCA8337, QCM6490, QCS6490, QCX315, SA515M, SD 675, SD 8 Gen1 5G, SD480, SD675, SD678, SD690 5G, SD720G, SD730, SD750G, SD765, SD765G, SD768G, SD778G, SD780G, SD8 -
II. Public POCs for CVE-2021-30347
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III. Intelligence Information for CVE-2021-30347
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IV. Related Vulnerabilities
Same product: Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Industrial IOT, Snapdragon Mobile
Same vendor: Qualcomm, Inc.
V. Comments for CVE-2021-30347

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