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I. Basic Information for CVE-2022-25651
Vulnerability Information
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Vulnerability Title
N/A
Source: NVD (National Vulnerability Database)
Vulnerability Description
Memory corruption in bluetooth host due to integer overflow while processing BT HFP-UNIT profile in Snapdragon Auto, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music
Source: NVD (National Vulnerability Database)
CVSS Information
CVSS:3.1/AV:N/AC:L/PR:N/UI:N/S:U/C:H/I:H/A:H
Source: NVD (National Vulnerability Database)
Vulnerability Type
N/A
Source: NVD (National Vulnerability Database)
Vulnerability Title
Qualcomm 芯片输入验证错误漏洞
Source: CNNVD (China National Vulnerability Database)
Vulnerability Description
Qualcomm 芯片是美国高通（Qualcomm）公司的芯片。一种将电路（主要包括半导体设备，也包括被动组件等）小型化的方式，并时常制造在半导体晶圆表面上。 Qualcomm存在输入验证错误漏洞，该漏洞源于在处理 BT HFP-UNIT 配置文件时Automotive Connectivity中的整数溢出。远程攻击者利用该漏洞触发整数溢出并在目标系统上执行任意代码。
Source: CNNVD (China National Vulnerability Database)
CVSS Information
N/A
Source: CNNVD (China National Vulnerability Database)
Vulnerability Type
N/A
Source: CNNVD (China National Vulnerability Database)
Affected Products
VendorProductAffected VersionsCPESubscribe
Qualcomm, Inc.Snapdragon Auto, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music APQ8009, APQ8017, APQ8053, APQ8096AU, AR8031, CSRA6620, CSRA6640, CSRB31024, MDM9150, MDM9250, MDM9607, MDM9626, MDM9628, MDM9640, MDM9650, QCA4020, QCA6174A, QCA6564A, QCA6564AU, QCA6574, QCA6574A, QCA6574AU, QCA6584, QCA6595, QCA6595AU, QCA6696, QCA9367 -
II. Public POCs for CVE-2022-25651
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III. Intelligence Information for CVE-2022-25651
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IV. Related Vulnerabilities
Same product: Snapdragon Auto, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music
Same vendor: Qualcomm, Inc.
V. Comments for CVE-2022-25651

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