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I. Basic Information for CVE-2022-22071
Vulnerability Information
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Vulnerability Title
N/A
Source: NVD (National Vulnerability Database)
Vulnerability Description
Possible use after free when process shell memory is freed using IOCTL munmap call and process initialization is in progress in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music
Source: NVD (National Vulnerability Database)
CVSS Information
CVSS:3.1/AV:L/AC:L/PR:N/UI:N/S:U/C:H/I:H/A:H
Source: NVD (National Vulnerability Database)
Vulnerability Type
N/A
Source: NVD (National Vulnerability Database)
Vulnerability Title
Qualcomm多款产品 资源管理错误漏洞
Source: CNNVD (China National Vulnerability Database)
Vulnerability Description
Qualcomm Snapdragon SOC（骁龙处理器）是美国高通（Qualcomm）公司的一款应用于移动设备处理信息的芯片。 Qualcomm多款产品存在安全漏洞，该漏洞源于在使用IOCTL munmap调用释放进程外壳内存并进行进程初始化时出现释放后重用情况。
Source: CNNVD (China National Vulnerability Database)
CVSS Information
N/A
Source: CNNVD (China National Vulnerability Database)
Vulnerability Type
N/A
Source: CNNVD (China National Vulnerability Database)
Affected Products
VendorProductAffected VersionsCPESubscribe
Qualcomm, Inc.Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music APQ8053, AR8031, AR8035, CSRA6620, CSRA6640, MDM9150, MSM8953, QCA6174A, QCA6390, QCA6391, QCA6426, QCA6436, QCA6574, QCA6574A, QCA6574AU, QCA6595AU, QCA6696, QCA8081, QCA8337, QCA9377, QCM2290, QCM4290, QCM6490, QCS2290, QCS405, QCS410, QCS4290, QCS610, -
II. Public POCs for CVE-2022-22071
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III. Intelligence Information for CVE-2022-22071
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IV. Related Vulnerabilities
Same product: Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music
Same vendor: Qualcomm, Inc.
V. Comments for CVE-2022-22071

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