CVE-2021-30260
Quick assessment
Affected
Qualcomm, Inc. Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wired Infrastructure and Networking
Exploitation
No confirmed in-the-wild exploitation; assess based on exposure
Recommended action
Check the vendor advisory and references for a fixed version. If immediate upgrade is impossible, restrict exposure and increase monitoring.
Qualcomm 芯片是美国高通（Qualcomm）公司的芯片。一种将电路（主要包括半导体设备，也包括被动组件等）小型化的方式，并时常制造在半导体晶圆表面上。 Qualcomm 芯片存在安全漏洞，该漏洞源于接收到 extscan hostlist 配置命令时输入参数验证不当。受影响的产品和版本包括:APQ8009, APQ8017, APQ8053, APQ8064AU, APQ8076, APQ8092, APQ8094, APQ8096AU, AQT1000, AR8031, AR8035, AR93
Possible ATT&CK Techniques 1 AI
T1190 · Exploit Public-Facing Application
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I. Basic Information for CVE-2021-30260
Vulnerability Information
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Vulnerability Title
N/A
Source: CVE Program / CVE List V5
Vulnerability Description
Possible Integer overflow to buffer overflow issue can occur due to improper validation of input parameters when extscan hostlist configuration command is received in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wired Infrastructure and Networking
Source: CVE Program / CVE List V5
CVSS Information
CVSS:3.1/AV:L/AC:L/PR:N/UI:N/S:U/C:H/I:H/A:H
Source: CVE Program / CVE List V5
Vulnerability Type
N/A
Source: CVE Program / CVE List V5
Vulnerability Title
多款Qualcomm产品输入验证错误漏洞
Source: CNNVD (China National Vulnerability Database)
Vulnerability Description
Qualcomm 芯片是美国高通（Qualcomm）公司的芯片。一种将电路（主要包括半导体设备，也包括被动组件等）小型化的方式，并时常制造在半导体晶圆表面上。 Qualcomm 芯片存在安全漏洞，该漏洞源于接收到 extscan hostlist 配置命令时输入参数验证不当。受影响的产品和版本包括:APQ8009, APQ8017, APQ8053, APQ8064AU, APQ8076, APQ8092, APQ8094, APQ8096AU, AQT1000, AR8031, AR8035, AR93
Source: CNNVD (China National Vulnerability Database)
CVSS Information
N/A
Source: CNNVD (China National Vulnerability Database)
Vulnerability Type
N/A
Source: CNNVD (China National Vulnerability Database)
Affected Products
| Vendor | Product | Affected Versions | CPE | Subscribe |
|---|---|---|---|---|
| Qualcomm, Inc. | Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wired Infrastructure an | APQ8009, APQ8017, APQ8053, APQ8064AU, APQ8076, APQ8092, APQ8094, APQ8096AU, AQT1000, AR8031, AR8035, AR9380, CSR6030, CSR8811, CSRA6620, CSRA6640, CSRB31024, IPQ4018, IPQ4028, IPQ4029, IPQ5010, IPQ5018, IPQ5028, IPQ6000, IPQ6005, IPQ6010, IPQ6018, IPQ6028 | - |
|
II. Public POCs for CVE-2021-30260
| # | POC Description | Source Link | Shenlong Link |
|---|
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Other References for CVE-2021-30260 (1)
-
https://www.qualcomm.com/company/product-security/bulletins/august-2021-bulletin x_refsource_CONFIRM
Same Patch Batch · Qualcomm, Inc. · 2021-09-17 · 5 CVEs total
| CVE-2021-1976 | 9.8 CRITICAL | 多款Qualcomm产品资源管理错误漏洞 |
| CVE-2021-1939 | 8.4 HIGH | 多款Qualcomm产品代码问题漏洞 |
| CVE-2021-1947 | 8.4 HIGH | 多款Qualcomm产品资源管理错误漏洞 |
| CVE-2021-30261 | 8.4 HIGH | 多款Qualcomm产品输入验证错误漏洞 |
IV. Related Vulnerabilities
V. Comments for CVE-2021-30260
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