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I. Basic Information for CVE-2021-30269
Vulnerability Information
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Vulnerability Title
N/A
Source: NVD (National Vulnerability Database)
Vulnerability Description
Possible null pointer dereference due to lack of TLB validation for user provided address in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Voice & Music, Snapdragon Wired Infrastructure and Networking
Source: NVD (National Vulnerability Database)
CVSS Information
CVSS:3.1/AV:L/AC:L/PR:N/UI:N/S:U/C:L/I:L/A:H
Source: NVD (National Vulnerability Database)
Vulnerability Type
N/A
Source: NVD (National Vulnerability Database)
Vulnerability Title
Qualcomm 芯片代码问题漏洞
Source: CNNVD (China National Vulnerability Database)
Vulnerability Description
Qualcomm 芯片是美国高通（Qualcomm）公司的芯片。一种将电路（主要包括半导体设备，也包括被动组件等）小型化的方式，并时常制造在半导体晶圆表面上。 Qualcomm Chipsets 存在代码问题漏洞，该漏洞源于缺乏验证用户提供的输入，可能在线程缓存操作处理程序中空指针解引用。
Source: CNNVD (China National Vulnerability Database)
CVSS Information
N/A
Source: CNNVD (China National Vulnerability Database)
Vulnerability Type
N/A
Source: CNNVD (China National Vulnerability Database)
Affected Products
VendorProductAffected VersionsCPESubscribe
Qualcomm, Inc.Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Voice & Music, Snapdragon Wired Infrastructure and Networking AR8031, AR8035, CSRA6620, CSRA6640, CSRB31024, FSM10055, FSM10056, MDM9150, MDM9205, QCA2066, QCA4004, QCA6174A, QCA6390, QCA6391, QCA6426, QCA6436, QCA6564, QCA6564A, QCA6564AU, QCA6574, QCA6574A, QCA6574AU, QCA6595AU, QCA6696, QCA8081, QCA8337, QCA9377, -
II. Public POCs for CVE-2021-30269
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III. Intelligence Information for CVE-2021-30269
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IV. Related Vulnerabilities
Same vendor: Qualcomm, Inc.
V. Comments for CVE-2021-30269

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