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I. Basic Information for CVE-2021-30336
Vulnerability Information
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Vulnerability Title
N/A
Source: NVD (National Vulnerability Database)
Vulnerability Description
Possible out of bound read due to lack of domain input validation while processing APK close session request in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Industrial IOT, Snapdragon Wearables
Source: NVD (National Vulnerability Database)
CVSS Information
CVSS:3.1/AV:L/AC:L/PR:N/UI:N/S:U/C:H/I:H/A:H
Source: NVD (National Vulnerability Database)
Vulnerability Type
N/A
Source: NVD (National Vulnerability Database)
Vulnerability Title
Qualcomm 芯片缓冲区错误漏洞
Source: CNNVD (China National Vulnerability Database)
Vulnerability Description
Qualcomm 芯片是美国高通（Qualcomm）公司的芯片。一种将电路（主要包括半导体设备，也包括被动组件等）小型化的方式，并时常制造在半导体晶圆表面上。 qualcomm产品存在安全漏洞，受影响的产品和版本有:QCA6390, QCA6391, QCA6574, QCA6574A, QCA6574AU, QCA6595AU, QCA6696, QCM2290, QCM4290, QCM6490, QCS2290, QCS4290, QCS6490, Qualcomm215, SA6145P, SA6
Source: CNNVD (China National Vulnerability Database)
CVSS Information
N/A
Source: CNNVD (China National Vulnerability Database)
Vulnerability Type
N/A
Source: CNNVD (China National Vulnerability Database)
Affected Products
VendorProductAffected VersionsCPESubscribe
Qualcomm, Inc.Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Industrial IOT, Snapdragon Wearables QCA6390, QCA6391, QCA6574, QCA6574A, QCA6574AU, QCA6595AU, QCA6696, QCM2290, QCM4290, QCM6490, QCS2290, QCS4290, QCS6490, Qualcomm215, SA6145P, SA6150P, SA6155, SA6155P, SA8145P, SA8150P, SA8155, SA8155P, SA8195P, SD 675, SD460, SD480, SD662, SD665, SD675 -
II. Public POCs for CVE-2021-30336
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III. Intelligence Information for CVE-2021-30336
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IV. Related Vulnerabilities
Same product: Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Industrial IOT, Snapdragon Wearables
Same vendor: Qualcomm, Inc.
V. Comments for CVE-2021-30336

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