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I. Basic Information for CVE-2021-30273
Vulnerability Information

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Vulnerability Title
N/A
Source: NVD (National Vulnerability Database)
Vulnerability Description
Possible assertion due to improper handling of IPV6 packet with invalid length in destination options header in Snapdragon Auto, Snapdragon Compute, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Wearables
Source: NVD (National Vulnerability Database)
CVSS Information
CVSS:3.1/AV:N/AC:L/PR:N/UI:N/S:U/C:N/I:N/A:H
Source: NVD (National Vulnerability Database)
Vulnerability Type
N/A
Source: NVD (National Vulnerability Database)
Vulnerability Title
Qualcomm 芯片安全漏洞
Source: CNNVD (China National Vulnerability Database)
Vulnerability Description
Qualcomm 芯片是美国高通(Qualcomm)公司的芯片。一种将电路(主要包括半导体设备,也包括被动组件等)小型化的方式,并时常制造在半导体晶圆表面上。 Qualcomm 芯片 存在安全漏洞,该漏洞源于IPV6 数据包处理不当而导致的可能断言,目标选项标头中的长度无效。
Source: CNNVD (China National Vulnerability Database)
CVSS Information
N/A
Source: CNNVD (China National Vulnerability Database)
Vulnerability Type
N/A
Source: CNNVD (China National Vulnerability Database)
Affected Products
VendorProductAffected VersionsCPESubscribe
Qualcomm, Inc.Snapdragon Auto, Snapdragon Compute, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Wearables APQ8009W, APQ8096AU, AR6003, CSRB31024, MDM8207, MDM9205, MDM9206, MDM9207, MDM9215, MDM9250, MDM9607, MDM9615, MDM9628, MDM9640, MDM9650, MSM8909W, MSM8996AU, QCA4004, QCA6174A, QCA6564A, QCA6564AU, QCA6574, QCA6574A, QCA6574AU, QCA6584, QCA6584AU, QCA65 -
II. Public POCs for CVE-2021-30273
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III. Intelligence Information for CVE-2021-30273
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IV. Related Vulnerabilities
V. Comments for CVE-2021-30273

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