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I. Basic Information for CVE-2021-30331
Vulnerability Information
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Vulnerability Title
N/A
Source: NVD (National Vulnerability Database)
Vulnerability Description
Possible buffer overflow due to improper data validation of external commands sent via DIAG interface in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Wearables
Source: NVD (National Vulnerability Database)
CVSS Information
CVSS:3.1/AV:L/AC:L/PR:L/UI:N/S:U/C:H/I:N/A:N
Source: NVD (National Vulnerability Database)
Vulnerability Type
N/A
Source: NVD (National Vulnerability Database)
Vulnerability Title
Qualcomm 芯片 信息泄露漏洞
Source: CNNVD (China National Vulnerability Database)
Vulnerability Description
Qualcomm 芯片是美国高通（Qualcomm）公司的芯片。一种将电路（主要包括半导体设备，也包括被动组件等）小型化的方式，并时常制造在半导体晶圆表面上。 Qualcomm 芯片存在信息泄露漏洞，该漏洞源于产品未对DIAG接口发送的外部命令进行有效验证。攻击者可通过该漏洞导致缓冲区溢出。
Source: CNNVD (China National Vulnerability Database)
CVSS Information
N/A
Source: CNNVD (China National Vulnerability Database)
Vulnerability Type
N/A
Source: CNNVD (China National Vulnerability Database)
Affected Products
VendorProductAffected VersionsCPESubscribe
Qualcomm, Inc.Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Wearables AR8035, FSM10055, FSM10056, MDM9150, MDM9650, QCA6174A, QCA6390, QCA6391, QCA6426, QCA6436, QCA8081, QCA8337, QCA9377, QCM2290, QCM4290, QCM6125, QCM6490, QCS2290, QCS410, QCS4290, QCS610, QCS6125, QCS6490, QCX315, SD 675, SD 8 Gen1 5G, SD460, SD480, SD66 -
II. Public POCs for CVE-2021-30331
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III. Intelligence Information for CVE-2021-30331
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New Vulnerabilities
Product: Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Wearables
Vendor: Qualcomm, Inc.
V. Comments for CVE-2021-30331

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