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I. Basic Information for CVE-2021-35110
Vulnerability Information
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Vulnerability Title
N/A
Source: NVD (National Vulnerability Database)
Vulnerability Description
Possible buffer overflow to improper validation of hash segment of file while allocating memory in Snapdragon Connectivity, Snapdragon Mobile
Source: NVD (National Vulnerability Database)
CVSS Information
CVSS:3.1/AV:L/AC:H/PR:N/UI:N/S:C/C:H/I:H/A:H
Source: NVD (National Vulnerability Database)
Vulnerability Type
N/A
Source: NVD (National Vulnerability Database)
Vulnerability Title
Qualcomm 芯片 代码问题漏洞
Source: CNNVD (China National Vulnerability Database)
Vulnerability Description
Qualcomm 芯片是美国高通（Qualcomm）公司的芯片。一种将电路（主要包括半导体设备，也包括被动组件等）小型化的方式，并时常制造在半导体晶圆表面上。 Qualcomm 多款产品存在代码问题漏洞，该漏洞源于分配内存时可能会出现缓冲区溢出，导致文件哈希段验证不正确。以下产品和版本受到影响:SD 8 Gen1 5G, WCD9380, WCN6855, WCN6856, WSA8830, WSA8835。
Source: CNNVD (China National Vulnerability Database)
CVSS Information
N/A
Source: CNNVD (China National Vulnerability Database)
Vulnerability Type
N/A
Source: CNNVD (China National Vulnerability Database)
Affected Products
VendorProductAffected VersionsCPESubscribe
Qualcomm, Inc.Snapdragon Connectivity, Snapdragon Mobile SD 8 Gen1 5G, WCD9380, WCN6855, WCN6856, WSA8830, WSA8835 -
II. Public POCs for CVE-2021-35110
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III. Intelligence Information for CVE-2021-35110
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IV. Related Vulnerabilities
Same product: Snapdragon Connectivity, Snapdragon Mobile
Same vendor: Qualcomm, Inc.
V. Comments for CVE-2021-35110

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