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I. Basic Information for CVE-2021-35108
Vulnerability Information
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Vulnerability Title
N/A
Source: NVD (National Vulnerability Database)
Vulnerability Description
Improper checking of AP-S lock bit while verifying the secure resource group permissions can lead to non secure read and write access in Snapdragon Connectivity, Snapdragon Mobile
Source: NVD (National Vulnerability Database)
CVSS Information
CVSS:3.1/AV:P/AC:L/PR:N/UI:N/S:U/C:H/I:H/A:H
Source: NVD (National Vulnerability Database)
Vulnerability Type
N/A
Source: NVD (National Vulnerability Database)
Vulnerability Title
Qualcomm 芯片代码问题漏洞
Source: CNNVD (China National Vulnerability Database)
Vulnerability Description
Qualcomm 芯片是美国高通（Qualcomm）公司的芯片。一种将电路（主要包括半导体设备，也包括被动组件等）小型化的方式，并时常制造在半导体晶圆表面上。 Qualcomm多款产品存在代码问题漏洞，该漏洞源于在验证 Core 中的安全资源组权限时未正确检查 AP-S 锁定位。本地攻击者利用该漏洞可在系统上执行任意代码。
Source: CNNVD (China National Vulnerability Database)
CVSS Information
N/A
Source: CNNVD (China National Vulnerability Database)
Vulnerability Type
N/A
Source: CNNVD (China National Vulnerability Database)
Affected Products
VendorProductAffected VersionsCPESubscribe
Qualcomm, Inc.Snapdragon Connectivity, Snapdragon Mobile SD 8 Gen1 5G, SM7450, SM8475, SM8475P, WCD9370, WCD9375, WCD9380, WCD9385, WCN6750, WCN6855, WCN6856, WCN7851, WSA8830, WSA8832, WSA8835 -
II. Public POCs for CVE-2021-35108
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III. Intelligence Information for CVE-2021-35108
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IV. Related Vulnerabilities
Same product: Snapdragon Connectivity, Snapdragon Mobile
Same vendor: Qualcomm, Inc.
V. Comments for CVE-2021-35108

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