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I. Basic Information for CVE-2022-25657
Vulnerability Information
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Vulnerability Title
N/A
Source: NVD (National Vulnerability Database)
Vulnerability Description
Memory corruption due to buffer overflow occurs while processing invalid MKV clip which has invalid seek header in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Wearables
Source: NVD (National Vulnerability Database)
CVSS Information
CVSS:3.1/AV:N/AC:L/PR:N/UI:N/S:U/C:L/I:L/A:L
Source: NVD (National Vulnerability Database)
Vulnerability Type
N/A
Source: NVD (National Vulnerability Database)
Vulnerability Title
Qualcomm 芯片缓冲区错误漏洞
Source: CNNVD (China National Vulnerability Database)
Vulnerability Description
Qualcomm 芯片是美国高通（Qualcomm）公司的芯片。一种将电路（主要包括半导体设备，也包括被动组件等）小型化的方式，并时常制造在半导体晶圆表面上。 Qualcomm 存在缓冲区错误漏洞，该漏洞源于在处理具有无效搜索标头的无效 MKV 剪辑时缓冲区溢出而导致内存损坏，以下产品和版本受到影响：APQ8017, APQ8053, AQT1000, MSM8917, MSM8953, QCA6390, QCA6391, QCA6420, QCA6426, QCA6430, QCA6436, QCA65
Source: CNNVD (China National Vulnerability Database)
CVSS Information
N/A
Source: CNNVD (China National Vulnerability Database)
Vulnerability Type
N/A
Source: CNNVD (China National Vulnerability Database)
Affected Products
VendorProductAffected VersionsCPESubscribe
Qualcomm, Inc.Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Wearables APQ8017, APQ8053, AQT1000, MSM8917, MSM8953, QCA6390, QCA6391, QCA6420, QCA6426, QCA6430, QCA6436, QCA6574, QCA6574A, QCA6574AU, QCA6595AU, QCA6696, QCM2290, QCM4290, QCM6490, QCS2290, QCS4290, QCS6490, Qualcomm215, SA6155, SA6155P, SA8155, SA8155P, SA819 -
II. Public POCs for CVE-2022-25657
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III. Intelligence Information for CVE-2022-25657
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IV. Related Vulnerabilities
Same product: Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Wearables
Same vendor: Qualcomm, Inc.
V. Comments for CVE-2022-25657

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