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I. Basic Information for CVE-2022-22097
Vulnerability Information
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Vulnerability Title
N/A
Source: NVD (National Vulnerability Database)
Vulnerability Description
Memory corruption in graphic driver due to use after free while calling multiple threads application to driver. in Snapdragon Consumer IOT
Source: NVD (National Vulnerability Database)
CVSS Information
CVSS:3.1/AV:L/AC:L/PR:N/UI:N/S:U/C:H/I:H/A:H
Source: NVD (National Vulnerability Database)
Vulnerability Type
N/A
Source: NVD (National Vulnerability Database)
Vulnerability Title
Qualcomm 芯片资源管理错误漏洞
Source: CNNVD (China National Vulnerability Database)
Vulnerability Description
Qualcomm 芯片是美国高通（Qualcomm）公司的芯片。一种将电路（主要包括半导体设备，也包括被动组件等）小型化的方式，并时常制造在半导体晶圆表面上。 Qualcomm 芯片存在资源管理错误漏洞，该漏洞源于图形驱动程序中存在一个释放后重用错误。恶意应用程序可以触发释放后重用错误并以提升的权限执行任意代码。该漏洞允许本地应用程序提升系统上的权限。以下产品及版本受到影响：QCS410, QCS610, WCD9341, WCD9370, WCN3950, WCN3980, WSA8810, WSA88
Source: CNNVD (China National Vulnerability Database)
CVSS Information
N/A
Source: CNNVD (China National Vulnerability Database)
Vulnerability Type
N/A
Source: CNNVD (China National Vulnerability Database)
Affected Products
VendorProductAffected VersionsCPESubscribe
Qualcomm, Inc.Snapdragon Consumer IOT QCS410, QCS610, WCD9341, WCD9370, WCN3950, WCN3980, WSA8810, WSA8815 -
II. Public POCs for CVE-2022-22097
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III. Intelligence Information for CVE-2022-22097
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IV. Related Vulnerabilities
Same vendor: Qualcomm, Inc.
V. Comments for CVE-2022-22097

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