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I. Basic Information for CVE-2022-22096
Vulnerability Information
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Vulnerability Title
N/A
Source: NVD (National Vulnerability Database)
Vulnerability Description
Memory corruption in Bluetooth HOST due to stack-based buffer overflow when when extracting data using command length parameter in Snapdragon Connectivity, Snapdragon Mobile
Source: NVD (National Vulnerability Database)
CVSS Information
CVSS:3.1/AV:N/AC:L/PR:N/UI:N/S:U/C:H/I:H/A:H
Source: NVD (National Vulnerability Database)
Vulnerability Type
N/A
Source: NVD (National Vulnerability Database)
Vulnerability Title
Qualcomm 芯片缓冲区错误漏洞
Source: CNNVD (China National Vulnerability Database)
Vulnerability Description
Qualcomm 芯片是美国高通（Qualcomm）公司的芯片。一种将电路（主要包括半导体设备，也包括被动组件等）小型化的方式，并时常制造在半导体晶圆表面上。 Qualcomm 存在安全漏洞，该漏洞源于在使用命令长度参数提取数据时，基于堆栈的缓冲区溢出导致蓝牙主机中的内存损坏，以下产品和版本受到影响：AQT1000、QCA6390、QCA6391、SD 675、SD 8 Gen1 5G、SD460、SD480、SD662、SD665、SD675、SD678、SD680、SD690 5G、SD695、SD7
Source: CNNVD (China National Vulnerability Database)
CVSS Information
N/A
Source: CNNVD (China National Vulnerability Database)
Vulnerability Type
N/A
Source: CNNVD (China National Vulnerability Database)
Affected Products
VendorProductAffected VersionsCPESubscribe
Qualcomm, Inc.Snapdragon Connectivity, Snapdragon Mobile AQT1000, QCA6390, QCA6391, SD 675, SD 8 Gen1 5G, SD460, SD480, SD662, SD665, SD675, SD678, SD680, SD690 5G, SD695, SD720G, SD730, SD765, SD765G, SD768G, SD778G, SD780G, SD855, SD865 5G, SD870, SD888, SD888 5G, SDX55M, SM6250, SM7250P, SM7315, SM7325P, SM7 -
II. Public POCs for CVE-2022-22096
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III. Intelligence Information for CVE-2022-22096
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IV. Related Vulnerabilities
Same product: Snapdragon Connectivity, Snapdragon Mobile
Same vendor: Qualcomm, Inc.
V. Comments for CVE-2022-22096

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