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I. Basic Information for CVE-2021-35109
Vulnerability Information
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Vulnerability Title
N/A
Source: NVD (National Vulnerability Database)
Vulnerability Description
Possible address manipulation from APP-NS while APP-S is configuring an RG where it tries to merge the address ranges in Snapdragon Connectivity, Snapdragon Mobile
Source: NVD (National Vulnerability Database)
CVSS Information
CVSS:3.1/AV:P/AC:L/PR:N/UI:N/S:U/C:H/I:H/A:H
Source: NVD (National Vulnerability Database)
Vulnerability Type
N/A
Source: NVD (National Vulnerability Database)
Vulnerability Title
Qualcomm 芯片输入验证错误漏洞
Source: CNNVD (China National Vulnerability Database)
Vulnerability Description
Qualcomm 芯片是美国高通（Qualcomm）公司的芯片。一种将电路（主要包括半导体设备，也包括被动组件等）小型化的方式，并时常制造在半导体晶圆表面上。 Qualcomm多款产品存在输入验证错误漏洞，该漏洞源于对 Core 中用户提供的输入验证不充分。本地攻击者利用该漏洞可破坏目标系统。
Source: CNNVD (China National Vulnerability Database)
CVSS Information
N/A
Source: CNNVD (China National Vulnerability Database)
Vulnerability Type
N/A
Source: CNNVD (China National Vulnerability Database)
Affected Products
VendorProductAffected VersionsCPESubscribe
Qualcomm, Inc.Snapdragon Connectivity, Snapdragon Mobile SD 8 Gen1 5G, SM7450, SM8475, SM8475P, WCD9370, WCD9375, WCD9380, WCD9385, WCN6750, WCN6855, WCN6856, WCN7851, WSA8830, WSA8832, WSA8835 -
II. Public POCs for CVE-2021-35109
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III. Intelligence Information for CVE-2021-35109
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IV. Related Vulnerabilities
Same product: Snapdragon Connectivity, Snapdragon Mobile
Same vendor: Qualcomm, Inc.
V. Comments for CVE-2021-35109

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