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CVE-2021-30331

Quick assessment

Affected
Qualcomm, Inc. Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Wearables
Exploitation
No confirmed in-the-wild exploitation; assess based on exposure
Recommended action
Check the vendor advisory and references for a fixed version. If immediate upgrade is impossible, restrict exposure and increase monitoring.

Qualcomm 芯片是美国高通（Qualcomm）公司的芯片。一种将电路（主要包括半导体设备，也包括被动组件等）小型化的方式，并时常制造在半导体晶圆表面上。 Qualcomm 芯片存在信息泄露漏洞，该漏洞源于产品未对DIAG接口发送的外部命令进行有效验证。攻击者可通过该漏洞导致缓冲区溢出。

CVSS 5.5 · Medium EPSS 0.14% · P4
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I. Basic Information for CVE-2021-30331

Vulnerability Information
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Vulnerability Title
N/A
Source: CVE Program / CVE List V5
Vulnerability Description
Possible buffer overflow due to improper data validation of external commands sent via DIAG interface in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Wearables
Source: CVE Program / CVE List V5
CVSS Information
CVSS:3.1/AV:L/AC:L/PR:L/UI:N/S:U/C:H/I:N/A:N
Source: CVE Program / CVE List V5
Vulnerability Type
N/A
Source: CVE Program / CVE List V5
Vulnerability Title
Qualcomm 芯片 信息泄露漏洞
Source: CNNVD (China National Vulnerability Database)
Vulnerability Description
Qualcomm 芯片是美国高通（Qualcomm）公司的芯片。一种将电路（主要包括半导体设备，也包括被动组件等）小型化的方式，并时常制造在半导体晶圆表面上。 Qualcomm 芯片存在信息泄露漏洞，该漏洞源于产品未对DIAG接口发送的外部命令进行有效验证。攻击者可通过该漏洞导致缓冲区溢出。
Source: CNNVD (China National Vulnerability Database)
CVSS Information
N/A
Source: CNNVD (China National Vulnerability Database)
Vulnerability Type
N/A
Source: CNNVD (China National Vulnerability Database)

Affected Products

Vendor Product Affected Versions CPE Subscribe
Qualcomm, Inc. Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Wearables AR8035, FSM10055, FSM10056, MDM9150, MDM9650, QCA6174A, QCA6390, QCA6391, QCA6426, QCA6436, QCA8081, QCA8337, QCA9377, QCM2290, QCM4290, QCM6125, QCM6490, QCS2290, QCS410, QCS4290, QCS610, QCS6125, QCS6490, QCX315, SD 675, SD 8 Gen1 5G, SD460, SD480, SD66 -

II. Public POCs for CVE-2021-30331

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III. Intelligence Information for CVE-2021-30331

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Other References for CVE-2021-30331 (1)

Same Patch Batch · Qualcomm, Inc. · 2022-04-01 · 15 CVEs total

CVE-2021-1942 9.3 CRITICAL Qualcomm 芯片 缓冲区错误漏洞
CVE-2021-35089 8.4 HIGH Qualcomm 芯片 资源管理错误漏洞
CVE-2021-35105 8.4 HIGH Qualcomm 芯片代码问题漏洞
CVE-2021-35115 8.4 HIGH Qualcomm 芯片 资源管理错误漏洞
CVE-2021-35088 8.2 HIGH Qualcomm 芯片缓冲区错误漏洞
CVE-2021-35117 8.2 HIGH Qualcomm 芯片 缓冲区错误漏洞
CVE-2021-35110 8.1 HIGH Qualcomm 芯片 代码问题漏洞
CVE-2021-1950 7.8 HIGH Qualcomm 芯片 授权问题漏洞
CVE-2021-30333 7.8 HIGH Qualcomm 芯片缓冲区错误漏洞
CVE-2021-35103 7.8 HIGH Qualcomm 芯片缓冲区错误漏洞
CVE-2021-35106 7.8 HIGH Qualcomm 芯片 缓冲区错误漏洞
CVE-2021-30328 7.5 HIGH Qualcomm 芯片安全漏洞
CVE-2021-30329 7.5 HIGH Qualcomm 芯片安全漏洞
CVE-2021-30332 7.5 HIGH Qualcomm 芯片安全漏洞

IV. Related Vulnerabilities

Same product: Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Wearables
Same vendor: Qualcomm, Inc.

V. Comments for CVE-2021-30331

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