CVE-2021-35134
Quick assessment
Affected
Qualcomm, Inc. Snapdragon Connectivity, Snapdragon Industrial IOT, Snapdragon Mobile
Exploitation
No confirmed in-the-wild exploitation; assess based on exposure
Recommended action
Check the vendor advisory and references for a fixed version. If immediate upgrade is impossible, restrict exposure and increase monitoring.
Qualcomm 芯片是美国高通（Qualcomm）公司的芯片。一种将电路（主要包括半导体设备，也包括被动组件等）小型化的方式，并时常制造在半导体晶圆表面上。 Qualcomm 多款产品存在安全漏洞，该漏洞源于Boot 中的 ELF 标头验证不足。远程攻击者可以利用该漏洞触发内存损坏并在目标系统上执行任意代码。
Possible ATT&CK Techniques 1 AI
T1190 · Exploit Public-Facing Application
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I. Basic Information for CVE-2021-35134
Vulnerability Information
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Vulnerability Title
N/A
Source: CVE Program / CVE List V5
Vulnerability Description
Due to insufficient validation of ELF headers, an Incorrect Calculation of Buffer Size can occur in Boot leading to memory corruption in Snapdragon Connectivity, Snapdragon Industrial IOT, Snapdragon Mobile
Source: CVE Program / CVE List V5
CVSS Information
CVSS:3.1/AV:L/AC:L/PR:N/UI:N/S:U/C:H/I:H/A:H
Source: CVE Program / CVE List V5
Vulnerability Type
N/A
Source: CVE Program / CVE List V5
Vulnerability Title
Qualcomm 芯片安全漏洞
Source: CNNVD (China National Vulnerability Database)
Vulnerability Description
Qualcomm 芯片是美国高通（Qualcomm）公司的芯片。一种将电路（主要包括半导体设备，也包括被动组件等）小型化的方式，并时常制造在半导体晶圆表面上。 Qualcomm 多款产品存在安全漏洞，该漏洞源于Boot 中的 ELF 标头验证不足。远程攻击者可以利用该漏洞触发内存损坏并在目标系统上执行任意代码。
Source: CNNVD (China National Vulnerability Database)
CVSS Information
N/A
Source: CNNVD (China National Vulnerability Database)
Vulnerability Type
N/A
Source: CNNVD (China National Vulnerability Database)
Affected Products
| Vendor | Product | Affected Versions | CPE | Subscribe |
|---|---|---|---|---|
| Qualcomm, Inc. | Snapdragon Connectivity, Snapdragon Industrial IOT, Snapdragon Mobile | QCA6391, QCM6490, QCS6490, QSM8350, SD 8 Gen1 5G, SD778G, SD780G, SD888, SD888 5G, SM7315, SM7325P, SM7450, SM8475, SM8475P, WCD9341, WCD9370, WCD9375, WCD9380, WCD9385, WCN6740, WCN6750, WCN6850, WCN6851, WCN6855, WCN6856, WCN7850, WCN7851, WSA8830, WSA8 | - |
|
II. Public POCs for CVE-2021-35134
| # | POC Description | Source Link | Shenlong Link |
|---|
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Other References for CVE-2021-35134 (1)
-
https://www.qualcomm.com/company/product-security/bulletins/august-2022-bulletin x_refsource_CONFIRM
Same Patch Batch · Qualcomm, Inc. · 2022-09-02 · 30 CVEs total
| CVE-2022-22096 | 9.8 CRITICAL | Qualcomm 芯片缓冲区错误漏洞 |
| CVE-2021-35122 | 9.3 CRITICAL | Qualcomm 芯片输入验证错误漏洞 |
| CVE-2022-25680 | 8.4 HIGH | Qualcomm Multimedia 安全漏洞 |
| CVE-2021-35132 | 8.4 HIGH | Qualcomm 芯片缓冲区错误漏洞 |
| CVE-2022-22059 | 8.4 HIGH | Google Pixel 缓冲区错误漏洞 |
| CVE-2022-22080 | 8.4 HIGH | Google Pixel 缓冲区错误漏洞 |
| CVE-2022-22097 | 8.4 HIGH | Qualcomm 芯片资源管理错误漏洞 |
| CVE-2022-22098 | 8.4 HIGH | Qualcomm 芯片缓冲区错误漏洞 |
| CVE-2022-22099 | 8.4 HIGH | Qualcomm Multimedia 输入验证错误漏洞 |
| CVE-2022-22104 | 8.4 HIGH | Qualcomm 芯片缓冲区错误漏洞 |
| CVE-2022-22102 | 8.4 HIGH | Qualcomm 芯片代码问题漏洞 |
| CVE-2022-22106 | 8.4 HIGH | Qualcomm Multimedia 安全漏洞 |
| CVE-2022-22100 | 8.4 HIGH | Qualcomm 芯片缓冲区错误漏洞 |
| CVE-2022-22062 | 8.2 HIGH | Google Pixel 缓冲区错误漏洞 |
| CVE-2022-22070 | 7.8 HIGH | Google Pixel 缓冲区错误漏洞 |
| CVE-2022-22061 | 7.8 HIGH | Google Pixel 安全漏洞 |
| CVE-2022-22069 | 7.7 HIGH | Google Pixel 安全漏洞 |
| CVE-2022-22067 | 7.5 HIGH | Google Pixel 安全漏洞 |
| CVE-2022-25658 | 7.3 HIGH | Qualcomm 芯片缓冲区错误漏洞 |
| CVE-2021-35097 | 7.3 HIGH | Qualcomm 芯片数据伪造问题漏洞 |
Showing top 20 of 30 CVEs. View all on vendor page → →
IV. Related Vulnerabilities
V. Comments for CVE-2021-35134
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