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CVE-2022-25659

Quick assessment

Affected
Qualcomm, Inc. Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables
Exploitation
No confirmed in-the-wild exploitation; assess based on exposure
Recommended action
Check the vendor advisory and references for a fixed version. If immediate upgrade is impossible, restrict exposure and increase monitoring.

Qualcomm 芯片是美国高通（Qualcomm）公司的芯片。一种将电路（主要包括半导体设备，也包括被动组件等）小型化的方式，并时常制造在半导体晶圆表面上。 Qualcomm 存在缓冲区错误漏洞，该漏洞源于在解析位图大小无效的 MKV 剪辑时缓冲区溢出，导致内存损坏，以下产品和版本受到影响：APQ8009, APQ8009W, APQ8017, APQ8053, APQ8096AU, AQT1000, AR8031, CSRA6620, CSRA6640, MDM9206, MDM9250, MDM96

CVSS 7.3 · High EPSS 0.35% · P28

Possible ATT&CK Techniques 1 AI

T1190 · Exploit Public-Facing Application
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I. Basic Information for CVE-2022-25659

Vulnerability Information
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Vulnerability Title
N/A
Source: CVE Program / CVE List V5
Vulnerability Description
Memory corruption due to buffer overflow while parsing MKV clips with invalid bitmap size in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables
Source: CVE Program / CVE List V5
CVSS Information
CVSS:3.1/AV:N/AC:L/PR:N/UI:N/S:U/C:L/I:L/A:L
Source: CVE Program / CVE List V5
Vulnerability Type
N/A
Source: CVE Program / CVE List V5
Vulnerability Title
Qualcomm 芯片缓冲区错误漏洞
Source: CNNVD (China National Vulnerability Database)
Vulnerability Description
Qualcomm 芯片是美国高通（Qualcomm）公司的芯片。一种将电路（主要包括半导体设备，也包括被动组件等）小型化的方式，并时常制造在半导体晶圆表面上。 Qualcomm 存在缓冲区错误漏洞，该漏洞源于在解析位图大小无效的 MKV 剪辑时缓冲区溢出，导致内存损坏，以下产品和版本受到影响：APQ8009, APQ8009W, APQ8017, APQ8053, APQ8096AU, AQT1000, AR8031, CSRA6620, CSRA6640, MDM9206, MDM9250, MDM96
Source: CNNVD (China National Vulnerability Database)
CVSS Information
N/A
Source: CNNVD (China National Vulnerability Database)
Vulnerability Type
N/A
Source: CNNVD (China National Vulnerability Database)

Affected Products

Vendor Product Affected Versions CPE Subscribe
Qualcomm, Inc. Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables APQ8009, APQ8009W, APQ8017, APQ8053, APQ8096AU, AQT1000, AR8031, CSRA6620, CSRA6640, MDM9206, MDM9250, MDM9607, MDM9626, MDM9628, MDM9650, MSM8909W, MSM8917, MSM8937, MSM8953, MSM8996AU, PM8937, QCA4020, QCA6174A, QCA6310, QCA6320, QCA6335, QCA6390, QCA63 -

II. Public POCs for CVE-2022-25659

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III. Intelligence Information for CVE-2022-25659

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Other References for CVE-2022-25659 (1)

Same Patch Batch · Qualcomm, Inc. · 2022-09-02 · 30 CVEs total

CVE-2022-22096 9.8 CRITICAL Qualcomm 芯片缓冲区错误漏洞
CVE-2021-35122 9.3 CRITICAL Qualcomm 芯片输入验证错误漏洞
CVE-2022-25680 8.4 HIGH Qualcomm Multimedia 安全漏洞
CVE-2022-22059 8.4 HIGH Google Pixel 缓冲区错误漏洞
CVE-2022-22080 8.4 HIGH Google Pixel 缓冲区错误漏洞
CVE-2022-22097 8.4 HIGH Qualcomm 芯片资源管理错误漏洞
CVE-2022-22098 8.4 HIGH Qualcomm 芯片缓冲区错误漏洞
CVE-2022-22099 8.4 HIGH Qualcomm Multimedia 输入验证错误漏洞
CVE-2022-22100 8.4 HIGH Qualcomm 芯片缓冲区错误漏洞
CVE-2021-35134 8.4 HIGH Qualcomm 芯片安全漏洞
CVE-2022-22104 8.4 HIGH Qualcomm 芯片缓冲区错误漏洞
CVE-2022-22102 8.4 HIGH Qualcomm 芯片代码问题漏洞
CVE-2022-22106 8.4 HIGH Qualcomm Multimedia 安全漏洞
CVE-2021-35132 8.4 HIGH Qualcomm 芯片缓冲区错误漏洞
CVE-2022-22062 8.2 HIGH Google Pixel 缓冲区错误漏洞
CVE-2022-22061 7.8 HIGH Google Pixel 安全漏洞
CVE-2022-22070 7.8 HIGH Google Pixel 缓冲区错误漏洞
CVE-2022-22069 7.7 HIGH Google Pixel 安全漏洞
CVE-2022-22067 7.5 HIGH Google Pixel 安全漏洞
CVE-2022-25668 7.3 HIGH Google Android 资源管理错误漏洞

Showing top 20 of 30 CVEs. View all on vendor page → →

IV. Related Vulnerabilities

Same product: Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables
Same vendor: Qualcomm, Inc.

V. Comments for CVE-2022-25659

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