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I. Basic Information for CVE-2022-33225
Vulnerability Information
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Vulnerability Title
Use after free in Trusted Application Environment
Source: NVD (National Vulnerability Database)
Vulnerability Description
Memory corruption due to use after free in trusted application environment.
Source: NVD (National Vulnerability Database)
CVSS Information
CVSS:3.1/AV:L/AC:L/PR:H/UI:N/S:U/C:H/I:H/A:H
Source: NVD (National Vulnerability Database)
Vulnerability Type
释放后使用
Source: NVD (National Vulnerability Database)
Vulnerability Title
Qualcomm 芯片资源管理错误漏洞
Source: CNNVD (China National Vulnerability Database)
Vulnerability Description
Qualcomm 芯片是美国高通（Qualcomm）公司的芯片。一种将电路（主要包括半导体设备，也包括被动组件等）小型化的方式，并时常制造在半导体晶圆表面上。 Qualcomm 芯片存在安全漏洞，该漏洞源于由于在受信任的应用程序环境中释放后使用而导致内存损坏。
Source: CNNVD (China National Vulnerability Database)
CVSS Information
N/A
Source: CNNVD (China National Vulnerability Database)
Vulnerability Type
N/A
Source: CNNVD (China National Vulnerability Database)
Affected Products
VendorProductAffected VersionsCPESubscribe
Qualcomm, Inc.Snapdragon APQ8096AU -
II. Public POCs for CVE-2022-33225
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III. Intelligence Information for CVE-2022-33225
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IV. Related Vulnerabilities
Same product: Snapdragon
Same vendor: Qualcomm, Inc.
Same weakness: CWE-416
V. Comments for CVE-2022-33225

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