Goal Reached Thanks to every supporter — we hit 100%!

Goal: 1000 CNY · Raised: 1359 CNY

100%

CVE-2024-23360— Improper Access Control in Graphics Windows

Quick assessment

Affected
Qualcomm, Inc. Snapdragon
Exploitation
No confirmed in-the-wild exploitation; assess based on exposure
Recommended action
Check the vendor advisory and references for a fixed version. If immediate upgrade is impossible, restrict exposure and increase monitoring.

Qualcomm 芯片是美国高通(Qualcomm)公司的芯片。一种将电路(主要包括半导体设备,也包括被动组件等)小型化的方式,并时常制造在半导体晶圆表面上。 Qualcomm 芯片存在安全漏洞,该漏洞源于创建 LPAC 客户端时发生内存损坏,因为 LPAC 引擎被允许访问 GPU 寄存器。

CVSS 8.4 · High EPSS 0.09% · P0

Possible ATT&CK Techniques 1 AI

T1203 · Exploitation for Client Execution
Get alerts for future matching vulnerabilities Log in to subscribe

I. Basic Information for CVE-2024-23360

Vulnerability Information

Have questions about the vulnerability? See if Shenlong's analysis helps!
View Shenlong Deep Dive ↗

Although we use advanced large model technology, its output may still contain inaccurate or outdated information.Shenlong tries to ensure data accuracy, but please verify and judge based on the actual situation.

Vulnerability Title
Improper Access Control in Graphics Windows
Source: CVE Program / CVE List V5
Vulnerability Description
Memory corruption while creating a LPAC client as LPAC engine was allowed to access GPU registers.
Source: CVE Program / CVE List V5
CVSS Information
CVSS:3.1/AV:L/AC:L/PR:N/UI:N/S:U/C:H/I:H/A:H
Source: CVE Program / CVE List V5
Vulnerability Type
访问控制不恰当
Source: CVE Program / CVE List V5
Vulnerability Title
Qualcomm 芯片 安全漏洞
Source: CNNVD (China National Vulnerability Database)
Vulnerability Description
Qualcomm 芯片是美国高通(Qualcomm)公司的芯片。一种将电路(主要包括半导体设备,也包括被动组件等)小型化的方式,并时常制造在半导体晶圆表面上。 Qualcomm 芯片存在安全漏洞,该漏洞源于创建 LPAC 客户端时发生内存损坏,因为 LPAC 引擎被允许访问 GPU 寄存器。
Source: CNNVD (China National Vulnerability Database)
CVSS Information
N/A
Source: CNNVD (China National Vulnerability Database)
Vulnerability Type
N/A
Source: CNNVD (China National Vulnerability Database)

Affected Products

Vendor Product Affected Versions CPE Subscribe
Qualcomm, Inc. Snapdragon FastConnect 6700 -

II. Public POCs for CVE-2024-23360

# POC Description Source Link Shenlong Link
AI-Generated POC Premium

No public POC found.

Login to generate AI POC

III. Intelligence Information for CVE-2024-23360

请登录查看更多情报信息。

Other References for CVE-2024-23360 (1)

Same Patch Batch · Qualcomm, Inc. · 2024-06-03 · 12 CVEs total

CVE-2023-43538 9.3 CRITICAL Buffer Copy Without Checking Size of Input (`Classic Buffer Overflow`) in TZ Secure OS
CVE-2023-43556 9.3 CRITICAL Buffer Copy Without Checking Size of Input in Hypervisor
CVE-2023-43551 9.1 CRITICAL Improper Authentication in Multi-Mode Call Processor
CVE-2023-43555 8.2 HIGH Buffer Over-read in Video
CVE-2023-43542 7.8 HIGH Buffer Copy Without Checking Size of Input in Trusted Execution Environment
CVE-2024-23363 7.5 HIGH Buffer Over-read in WLAN Firmware
CVE-2023-43543 6.7 MEDIUM Use After Free in Audio
CVE-2023-43544 6.7 MEDIUM Use After Free in Audio
CVE-2023-43545 6.7 MEDIUM Integer Overflow or Wraparound in WLAN HOST
CVE-2023-43537 6.5 MEDIUM Buffer Over-read in WLAN Host
CVE-2024-21478 6.2 MEDIUM NULL Pointer Dereference in Graphics

IV. Related Vulnerabilities

V. Comments for CVE-2024-23360

No comments yet


Leave a comment