Qualcomm 芯片是美国高通(Qualcomm)公司的芯片。一种将电路(主要包括半导体设备,也包括被动组件等)小型化的方式,并时常制造在半导体晶圆表面上。 Qualcomm 芯片存在安全漏洞,该漏洞源于创建 LPAC 客户端时发生内存损坏,因为 LPAC 引擎被允许访问 GPU 寄存器。
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| Vendor | Product | Affected Versions | CPE | Subscribe |
|---|---|---|---|---|
| Qualcomm, Inc. | Snapdragon | FastConnect 6700 | - |
|
| # | POC Description | Source Link | Shenlong Link |
|---|
No public POC found.
Login to generate AI POC| CVE-2023-43538 | 9.3 CRITICAL | Buffer Copy Without Checking Size of Input (`Classic Buffer Overflow`) in TZ Secure OS |
| CVE-2023-43556 | 9.3 CRITICAL | Buffer Copy Without Checking Size of Input in Hypervisor |
| CVE-2023-43551 | 9.1 CRITICAL | Improper Authentication in Multi-Mode Call Processor |
| CVE-2023-43555 | 8.2 HIGH | Buffer Over-read in Video |
| CVE-2023-43542 | 7.8 HIGH | Buffer Copy Without Checking Size of Input in Trusted Execution Environment |
| CVE-2024-23363 | 7.5 HIGH | Buffer Over-read in WLAN Firmware |
| CVE-2023-43543 | 6.7 MEDIUM | Use After Free in Audio |
| CVE-2023-43544 | 6.7 MEDIUM | Use After Free in Audio |
| CVE-2023-43545 | 6.7 MEDIUM | Integer Overflow or Wraparound in WLAN HOST |
| CVE-2023-43537 | 6.5 MEDIUM | Buffer Over-read in WLAN Host |
| CVE-2024-21478 | 6.2 MEDIUM | NULL Pointer Dereference in Graphics |
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