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CVE-2025-47402— Buffer Over-read in WLAN Firmware

Quick assessment

Affected
Qualcomm, Inc. Snapdragon
Exploitation
No confirmed in-the-wild exploitation; assess based on exposure
Recommended action
Check the vendor advisory and references for a fixed version. If immediate upgrade is impossible, restrict exposure and increase monitoring.

Qualcomm Chipsets是美国高通（Qualcomm）公司的一系列芯片组。 Qualcomm Chipsets存在安全漏洞，该漏洞源于处理包含过大身份验证信息元素的接收帧时，可能导致瞬时拒绝服务。

CVSS 6.5 · Medium EPSS 0.16% · P5

Possible ATT&CK Techniques 1 AI

T1499 · Endpoint Denial of Service
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I. Basic Information for CVE-2025-47402

Vulnerability Information
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Vulnerability Title
Buffer Over-read in WLAN Firmware
Source: CVE Program / CVE List V5
Vulnerability Description
Transient DOS when processing a received frame with an excessively large authentication information element.
Source: CVE Program / CVE List V5
CVSS Information
CVSS:3.1/AV:A/AC:L/PR:N/UI:N/S:U/C:N/I:N/A:H
Source: CVE Program / CVE List V5
Vulnerability Type
缓冲区上溢读取
Source: CVE Program / CVE List V5
Vulnerability Title
Qualcomm Chipsets 安全漏洞
Source: CNNVD (China National Vulnerability Database)
Vulnerability Description
Qualcomm Chipsets是美国高通（Qualcomm）公司的一系列芯片组。 Qualcomm Chipsets存在安全漏洞，该漏洞源于处理包含过大身份验证信息元素的接收帧时，可能导致瞬时拒绝服务。
Source: CNNVD (China National Vulnerability Database)
CVSS Information
N/A
Source: CNNVD (China National Vulnerability Database)
Vulnerability Type
N/A
Source: CNNVD (China National Vulnerability Database)

Affected Products

Vendor Product Affected Versions CPE Subscribe
Qualcomm, Inc. Snapdragon AR8035 -

II. Public POCs for CVE-2025-47402

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III. Intelligence Information for CVE-2025-47402

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Vendor Advisories for CVE-2025-47402 (1)

Same Patch Batch · Qualcomm, Inc. · 2026-02-02 · 9 CVEs total

CVE-2025-47358 7.8 HIGH Use After Free in Secure Processor
CVE-2025-47359 7.8 HIGH Use After Free in Secure Processor
CVE-2025-47397 7.8 HIGH Improper Release of Memory Before Removing Last Reference in Graphics
CVE-2025-47398 7.8 HIGH Use After Free in Graphics
CVE-2025-47399 7.8 HIGH Buffer Copy Without Checking Size of Input in Camera
CVE-2025-47366 7.1 HIGH Exposed Dangerous Method or Function in HLOS
CVE-2025-47363 6.8 MEDIUM Integer Overflow or Wraparound in Automotive
CVE-2025-47364 6.8 MEDIUM Integer Overflow or Wraparound in Automotive

IV. Related Vulnerabilities

Same product: Snapdragon
Same vendor: Qualcomm, Inc.
Same weakness: CWE-126