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CVE-2026-21366— Integer Overflow or Wraparound in Data Network Stack & Connectivity

Quick assessment

Affected
Qualcomm, Inc. Snapdragon
Exploitation
No confirmed in-the-wild exploitation; assess based on exposure
Recommended action
Check the vendor advisory and references for a fixed version. If immediate upgrade is impossible, restrict exposure and increase monitoring.

Qualcomm Chipsets是美国Qualcomm公司的一系列网络通信芯片组。 Qualcomm Chipsets存在数字错误漏洞，该漏洞源于处理大小接近最大允许值的数据包时发生内存损坏。

CVSS 7.8 · High EPSS 0.10% · P1

Affected Version Matrix 33

VendorProduct Version RangeStatus
Qualcomm, Inc. Snapdragon LeMans_AU_LGIT affected
LeMansAU affected
QAM8255P affected
QAM8295P affected
QAM8620P affected
QAMSRV1H affected
QAMSRV1M affected
QCA6574AU affected
… +25 more rows
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I. Basic Information for CVE-2026-21366

Vulnerability Information
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Vulnerability Title
Integer Overflow or Wraparound in Data Network Stack & Connectivity
Source: CVE Program / CVE List V5
Vulnerability Description
Memory corruption while processing a packet with a size close to the maximum allowed value.
Source: CVE Program / CVE List V5
CVSS Information
CVSS:3.1/AV:L/AC:L/PR:L/UI:N/S:U/C:H/I:H/A:H
Source: CVE Program / CVE List V5
Vulnerability Type
整数溢出或超界折返
Source: CVE Program / CVE List V5
Vulnerability Title
Qualcomm Chipsets 数字错误漏洞
Source: CNNVD (China National Vulnerability Database)
Vulnerability Description
Qualcomm Chipsets是美国Qualcomm公司的一系列网络通信芯片组。 Qualcomm Chipsets存在数字错误漏洞，该漏洞源于处理大小接近最大允许值的数据包时发生内存损坏。
Source: CNNVD (China National Vulnerability Database)
CVSS Information
N/A
Source: CNNVD (China National Vulnerability Database)
Vulnerability Type
N/A
Source: CNNVD (China National Vulnerability Database)

Affected Products

Vendor Product Affected Versions CPE Subscribe
Qualcomm, Inc. Snapdragon LeMans_AU_LGIT -

II. Public POCs for CVE-2026-21366

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III. Intelligence Information for CVE-2026-21366

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Vendor Advisories for CVE-2026-21366 (1)

Same Patch Batch · Qualcomm, Inc. · 2026-08-04 · 11 CVEs total

CVE-2026-25289 9.6 CRITICAL Stack-based Buffer Overflow in WLAN Firmware
CVE-2026-24079 8.1 HIGH Missing Authentication for Critical Function in Data Modem
CVE-2026-24083 7.8 HIGH Untrusted Pointer Dereference in Automotive Security
CVE-2026-24080 7.8 HIGH Buffer Copy Without Checking Size of Input in Biometrics
CVE-2026-25292 7.6 HIGH Improper Validation of Syntactic Correctness of Input in Automotive Linux OS
CVE-2026-24084 7.5 HIGH Insecure Security Identifier Mechanism in Multi-Mode Call Processor
CVE-2026-25288 7.4 HIGH Buffer Over-read in WLAN Firmware
CVE-2026-24076 6.7 MEDIUM Buffer Copy Without Checking Size of Input in Bluetooth HOST
CVE-2026-24078 6.5 MEDIUM Exposure of Private Personal Information to an Unauthorized Actor in Data Modem
CVE-2026-24077 6.5 MEDIUM Integer Underflow (Wrap or Wraparound) in WLAN Host

IV. Related Vulnerabilities

Same product: Snapdragon
Same vendor: Qualcomm, Inc.
Same weakness: CWE-190

V. Comments for CVE-2026-21366

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